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Cu-Pb-Sn Ternary System: Low Cu Additions to Pb-Sn- Binary System

Published online by Cambridge University Press:  15 February 2011

V. C. Marcotte
Affiliation:
IBM General Technology Division, D45K B330–89A East Fishkill Facility, Hopewell Jct., NY 12533
K. Schroder
Affiliation:
Syracuse University, Materials Science/409 Link Syracuse, NY 13210
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Abstract

A portion of the Cu-Pb-Sn ternary diagram was determined experimentally. The investigation was concentrated on the high Pb corner and, to a lesser extent of alloys from Sn to the binary Pb-Sn eutectic. The experimental techniques used were thermal analysis, metallography, and electron microprobe analysis. A new technique for determining liquidus temperatures was used. For the high Pb region the proposed ternary eutectic at 0.06 Cu 0.02% SnPb (all compositions are in weight %) was not observed. For most alloys the primary crystallization phase was Cu3Sn. It was shown that Cu6Sn5 exists in the solid state; for high Sn alloys, it was observed that the addition of Pb reduced the decomposition temperature of Cu6Sn5. A ternary eutectic reaction near the binary Pb-Sn eutectic was confirmed, and the temperature of the ternary eutectic was 1°K below that of the binary eutectic. Liquidus temperatures as well as other reactions detected by thermal analysis will be presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 1983

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References

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