Change in dopant diffusion was observed for Arsenic source drain extension (SDE) implants when they were performed at various dose rates. The high dose SDE implant amorphizes the surface of the silicon substrate and the thickness of the amorphous layer is strongly influenced by the rate of dopant bombardment. It is well known that the ion implantation process introduces excess interstitials. While the amorphous region is completely re-grown into single crystal during subsequent anneal without leaving behind extended defects, interstitials that are injected beyond the amorphous layer lead to formation of {311} defects or dislocation loops in the end of range region. During thermal processing, these extended defects dissolve, release interstitials, which in turn lead to transient enhanced diffusion of underlying Boron halo dopant. Dopant depth profiles measured by SIMS revealed different amount of Boron pile-up in the near surface region, corresponding to different SDE implant dose rates. In CMOS devices, this surface pile-up would correlate with a Boron pile-up in the channel region that would lead to a shift in transistor characteristics. Through this investigation, we were able to explain the mechanism causing device characteristics shift resulted from SDE implant with the same dose and energy but different dose rates.