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Effect of a Ge Barrier on the Microstructure of BaTiO3 Deposited on Silicon by Pulsed Laser Ablation
Published online by Cambridge University Press: 01 January 1992
Abstract
BaTiO3 (BT) thin films deposited using pulsed laser ablation on substrates of (100) Si and (100) Si with 0.3 μm Ge were examined. For one set of samples, approximately 2000 Å of BT was deposited at 70°C at O2 pressures of 0, 1.0 and 10.0 mT. In a second set, O2 pressures of 0 and 1.0 mT were used during deposition of 200 Å of BT at 450°C followed by a 5 minute anneal and deposition of an additional 2000 Å at 750°C. This gave a total sample matrix of 10 samples. Cross-sectional TEM revealed that an interfacial layer formed in the BT on Si samples but not in the BT on Ge samples. HREM analysis of the interfaces showed that the interfacial layer was amorphous. On Ge, the BT films were found to have large areas of epitactic growth along the interface. This was confirmed by diffraction tilt angle experiments which showed a strong preferred orientation of BT on Ge. No preferred orientation was found for BT on Si. Statistical grain size analysis of the films using multiple regression showed that the film microstructures were affected most strongly by the substrate type (Ge or Si) followed by the deposition temperature of the substrate. Only a weak effect of O2 pressure was observed.
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- Copyright © Materials Research Society 1993