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Engineered porous and coated Silica particulates for CMP applications

Published online by Cambridge University Press:  18 March 2011

K.S. Choi ,
R. Vacassy ,
N. Bassim  and
R. K. Singh
K.S. Choi
Affiliation:
Department of Materials Science and Engineering and Engineering Research Center for Particle Science and Technology, University of Florida, Gainesville, FL 32611
R. Vacassy
Affiliation:
Department of Materials Science and Engineering and Engineering Research Center for Particle Science and Technology, University of Florida, Gainesville, FL 32611
N. Bassim
Affiliation:
Department of Materials Science and Engineering and Engineering Research Center for Particle Science and Technology, University of Florida, Gainesville, FL 32611
R. K. Singh
Affiliation:
Department of Materials Science and Engineering and Engineering Research Center for Particle Science and Technology, University of Florida, Gainesville, FL 32611
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Abstract

The aim of this study has been to synthesize the microporous silica spheres and to coat as-synthesized SiO2 with CeO2 for CMP applications. First, spherical microporous silica powders with a narrow size distribution have been prepared by a precipitation technique involving the hydrolysis reaction of a silicon alkoxide in ethanol. The interparticle microporosity has been created by adsorption of an organic compound (glycerol) as the porogen. The presence of glycerol during the synthesis affects considerably the precipitation mechanism and its effect on the particle size will be discussed. The synthesis of silica microporous spheres of narrow size distribution yielded the preparation, by varying particle size and porosity, of a wide range of aqueous silica slurries. The influence of particle size, particle size distribution, porosity and particle concentration will be discussed in chemical mechanical polishing applications. Although silica particles show large plastic deformation than the bulk material, very good glass polishing rates are obtained due to the plastic deformation of the silica layer during CMP. Silica particles are suitable candidates for application in CMP because silica can be directly precipitated as monodispersed spheres, their narrow size distribution being an important requirement in CMP applications. Secondly, as-synthesized silica particles were coated with the cerium dioxide particles having hexagonal shape, which were precipitated by decomposition from the cerium precursors. For this study, three coating processes were introduced to investigate the best coating parameters. Improvements in CMP of glass were also obtained by coating silica particles with cerium oxide nanoparticles.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 671: Symposium M – Chemical-Mechanical Polishing 2001–Advances and Future Challenges , 2001 , M5.8
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1. Tomozawa, M., Solid State Technol. 40(7), 170–175 (1997).Google Scholar
2. Kelsall, A., Glass Technol. 39(1), 6–9 (1998).Google Scholar
3. Kolbe, G., Ph.D. thesis, Jena, Germany, 1956.Google Scholar
4. Stöber, W., Fink, A., and Bohn, E., J. Colloid Interface Sci. 26, 62–69(1968).10.1016/0021-9797(68)90272-5Google Scholar
5. La Mer, V. K., and Dinegar, R. H., J. Am. Ceram. Soc. 72, 4847 (1950).Google Scholar
6. La Mer, V. K., Ind. Eng. Chem. 44(6), 1270–1277 (1952).Google Scholar
7. Fleming, B. A., J. Colloid Interface Sci. 110, 40–64 (1986).10.1016/0021-9797(86)90351-6Google Scholar
8. Bogush, G. H., and Zukoski, C. F., J. Colloid Interface Sci. 142, 1–18(1991).10.1016/0021-9797(91)90029-8Google Scholar
9. Van Blaaderen, A., Van Geest, J., and Vrij, A., J. Colloid Interface Sci. 154,481–501 (1992).10.1016/0021-9797(92)90163-GGoogle Scholar
10. Matsoukas, T., and Gulari, E., J. Colloid Interface Sci. 145(2), 557–562(1991).10.1016/0021-9797(91)90385-LGoogle Scholar
11. Jelinek, L., Dong, P., Rojas-Pazos, C., H., Ta-òbi, and Kov≪ats, sz., E. Lang-muir 8(9), 2152–2164 (1992).Google Scholar
12. Bogush, G. H., and Zukoski, C. F., J. Colloid Interface Sci. 142, 19–34(1991).10.1016/0021-9797(91)90030-CGoogle Scholar
13. Bourgeat-Lami, E., and Lang, J., J. Colloid Interface Sci. 197, 293–308(1998).10.1006/jcis.1997.5265Google Scholar
14. Jelinek, L., and sz. Kov≪ ats, E., Langmuir 10(11), 4225–4231 (1994).Google Scholar