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Field Emission Properties of Thin Molybdenum Carbide and Diamond Films Deposited by Dielectrophoresis

Published online by Cambridge University Press:  10 February 2011

Ambrosio A. Rouse
Affiliation:
University of North Texas, Department of Physics & Material Science, Denton, Texas
John B. Bernhard
Affiliation:
University of North Texas, Department of Physics & Material Science, Denton, Texas
Edward D. Sosa
Affiliation:
University of North Texas, Department of Physics & Material Science, Denton, Texas
David E. Golden
Affiliation:
University of North Texas, Department of Physics & Material Science, Denton, Texas
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Abstract

Molybdenum carbide and diamond films were deposited at room temperature by dielectrophoresis on molybdenum foil and field emission tips. Films deposited on flat surfaces were characterized with XPS, UPS and SEM. Field emission Fowler-Nordheim current-voltage characteristics and electron energy distribution measurements were obtained using films deposited on field emission tips as part of a single aperture gated diode in a VG ESCALAB II system. Molybdenum trioxide was present after molybdenum carbide deposition at room temperature on all samples. At a temperature of about 650 °C, the dominant oxide changes to molybdenum dioxide. At about 800 °C, the oxygen content of the films significantly decreases and molybdenum carbide with significant graphite content remains. The UPS data for these samples were obtained at different annealing temperatures and a number of photon energies to determine photoelectric work functions for molybdenum trioxide, molybdenum dioxide and molybdenum carbide. The same kind of data was obtained for diamond deposited on molybdenum and molybdenum carbide coated foils and field emission tips.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Chalamala, B. R., Wallace, R.M. and Gnade, B.E., J. Vac. Sci. & Tech. 16,2859 (1998).Google Scholar
2. Jones, T. B., Electromechanics of Particles, Cambridge University Press, pp. 3438 (1995).Google Scholar
3. Listowski, W., Berg, A. H. J. van den, Hanekamp, I. J. and Silfhout, A. van, Surf. Interface Anal. 19, 93 (1992).Google Scholar
4. Wang, D., Lunsford, M. H. and Rosynek, M. P., J. Catal. 169, 347 (1997).Google Scholar
5. Zhang, C., Hove, M. A. Van, and Somorjau, G. A., Surf. Sci. 149, 326 (1985).Google Scholar
6. Rut'kov, E. V., Tontegode, A. Ya., Usufov, M. M., and Gall, N. R., Sov. Phys. Tech. Phys, 37, 10(1982).Google Scholar
7. Zaera, F., Kollin, E. and Gland, J. L., Chem. Phys. Lett. 121,464 (1985).Google Scholar
8. Wang, J., Castonguay, M., Deng, J., and McBreen, P. H., Surf. Sci. 374, 197 (1997).Google Scholar
9. Okuyama, F., Surf. Sci. 43, 293 (1974).Google Scholar
10. Gunion, R. F., Dixon-Warren, S. J. and Lineberger, W. C., J. Chem. Phys. 104, 1765 (1996).Google Scholar
11. Young, R. D. and Kuyatt, C. E., Rev. Sci. Instrum. 39, 477 (1968).Google Scholar
12. Fomenko, V. S. in Handbook of Thermionic Properties, edited by Samsonov, G. V., Plenum, New York, 1966, p.71.Google Scholar
13. Eastman, D. E., Phys. Review B. Solid State. 2, 1 (1970).Google Scholar
14. Werfel, F., and Minni, E., Phys. C, Solid State Phys., 16, 6091 (1983).Google Scholar
15. Choi, W. B., Liu, J., McClure, M. T., Myers, A. F., Zhirnov, V. V., Cuomo, J. J. and Hren, J. J., J.Vac. Sci. Technol. B 14 n.3, 2050 (1996).Google Scholar
16. Waite, M. M., and Ishah, S. I., Appl. Phys. Lett. 60, 2344 (1992).Google Scholar
17. Pate, B. B., Oshima, M., Silberman, J. A., Rossi, G., Lindau, I., and Spicer, W. E., J. Vac. Sci. Technol. A 2, 957 (1984).Google Scholar
18. Akwani, I. A., Sosa, E., Lim, S., Stallcup, R. E., Castillega, J., Bernhard, J., Golden, D. E., and Perez, J. M., Mater. Res. Soc. Proc., 509, 137 (1998).Google Scholar