Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Mountsier, Thomas W.
Samuels, John A.
and
Swope, Richard S.
1998.
Integration Studies of Plasma Deposited Fluorinated Amorphous Carbon.
MRS Proceedings,
Vol. 511,
Issue. ,
Yang, Hongning
Tweet, Douglas J.
Ma, Yanjun
and
Nguyen, Tue
1998.
Deposition of highly crosslinked fluorinated amorphous carbon film and structural evolution during thermal annealing.
Applied Physics Letters,
Vol. 73,
Issue. 11,
p.
1514.
Matsubara, Y.
Endo, K.
Iguchi, M.
Ito, N.
Aoyama, K.
Tatsumj, T.
and
Horiuchi, T.
1998.
Copper damascene using low dielectric constant fluorinated amorphous carbon interlayer.
MRS Proceedings,
Vol. 511,
Issue. ,
Mountsier, T.W.
and
Samuels, J.A.
1998.
Adhesion of fluorinated amorphous carbon to various materials [metallisation].
p.
280.
Mountsier, Thomas W.
and
Samuels, John A.
1998.
Precursor selection for plasma deposited fluorinated amorphous carbon films.
Thin Solid Films,
Vol. 332,
Issue. 1-2,
p.
362.
Ma, Yanjun
Yang, Hongning
Guo, J.
Sathe, C.
Agui, A.
and
Nordgren, J.
1998.
Structural and electronic properties of low dielectric constant fluorinated amorphous carbon films.
Applied Physics Letters,
Vol. 72,
Issue. 25,
p.
3353.
Yang, Hongning
Tweet, Douglas J.
Ma, Yanjun
Nguyen, Tue
Evans, David R.
and
Hsu, S.-T.
1998.
Thermal stability and structural evolution of low-K Fluorinated amorphous carbon during thermal annealing.
MRS Proceedings,
Vol. 511,
Issue. ,
Yang, Hongning
Evans, David R.
Nguyen, Tue
Stecker, Lisa H.
Ulrich, Bruce
and
Hsu, S.-T.
1999.
Multilevel Damascene Interconnection in Integration of MOCVD Cu and Low-k Fluorinated Amorphous Carbon.
MRS Proceedings,
Vol. 565,
Issue. ,
Endo, Kazuhiko
Shinoda, Keisuke
and
Tatsumi, Toru
1999.
Plasma deposition of low-dielectric-constant fluorinated amorphous carbon.
Journal of Applied Physics,
Vol. 86,
Issue. 5,
p.
2739.
Shirafuji, Tatsuru
Kamisawa, Akira
Shimasaki, Takaaki
Hayashi, Yasuaki
and
Nishino, Shigehiro
2000.
Plasma enhanced chemical vapor deposition of thermally stable and low-dielectric-constant fluorinated amorphous carbon films using low-global-warming-potential gas C5F8.
Thin Solid Films,
Vol. 374,
Issue. 2,
p.
256.
Maier, G
2001.
Low dielectric constant polymers for microelectronics.
Progress in Polymer Science,
Vol. 26,
Issue. 1,
p.
3.
Gill, W. N.
Rogojevic, S.
and
Lu, T.
2003.
Low Dielectric Constant Materials for IC Applications.
Vol. 9,
Issue. ,
p.
95.
Endo, K.
Kishimoto, K.
Matsubara, Y.
and
Koyanagi, K.
2003.
Low Dielectric Constant Materials for IC Applications.
Vol. 9,
Issue. ,
p.
121.
Maier, G.
2004.
The search for low-/spl epsiv/ and ultra-low-/spl epsiv/ dielectrics: how far can you get with polymers? Part 2: materials, structures, properties.
IEEE Electrical Insulation Magazine,
Vol. 20,
Issue. 3,
p.
6.
Robinson, K. M.
DeVriendt, K.
and
Evans, D. R.
2004.
Chemical-Mechanical Planarization of Semiconductor Materials.
Vol. 69,
Issue. ,
p.
351.