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Grain-Size and Impurity Effects in Low-Temperature Deposition of TiN

Published online by Cambridge University Press:  03 September 2012

H. Kakimy ,
F. Namavar ,
E. Tobin ,
J. Haupt ,
R. Bricault ,
J. P. Hirvonen  and
R. Ayer
H. Kakimy
Affiliation:
Spire Corporation, Bedford, MA
F. Namavar
Affiliation:
Spire Corporation, Bedford, MA
E. Tobin
Affiliation:
Spire Corporation, Bedford, MA
J. Haupt
Affiliation:
Institute for Advanced Materials, Ispra, Italy
R. Bricault
Affiliation:
Spire Corporation, Bedford, MA
J. P. Hirvonen
Affiliation:
Joint Research Centre, Petten, Netherlands
R. Ayer
Affiliation:
STEM, Inc. Woodbridge, CT
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Abstract

Commercially deposited titanium nitride (TIN) thin films have been available daring recent years. These TiN films possess high hardness and have good wear resistance; however, the deposition process typically requires a temperature of 500°C or higher. In many cases, due to substrate characteristics, a deposition temperature below 150°C is required in order to exploit TiN coating properties.

The objective of this work is to demonstrate that ion beam assisted deposition (IBAD) makes it possible to deposit gold-color TiN films with good adhesion onto a variety of substrates including plastics at temperatures below 150°C. These films have physical and mechanical properties as good as those produced at high temperatures. Samples have also been examined by nanohardness techniques to accurately determine the hardness of the films and relate them to process parameters and crystal sizes. Our results indicate that, by controlling the grain size of TiN, it is possible to fabricate TiN coatings at room temperature with hardness as high as 25.5 ± 1 GPa.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 438: Symposium A – Materials Modificaton and Synthesis by Ion Beam… , 1996 , 709
Copyright
Copyright © Materials Research Society 1997

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