Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-25T19:30:24.209Z Has data issue: false hasContentIssue false

The Implications of Energetic and Kinetic Surface Instability for a Stress Measurement Technique

Published online by Cambridge University Press:  10 February 2011

H. H. Yu
Affiliation:
Mechanical and aerospace engineering department, Princeton University, Princeton, NJ 08544
Z. Suo
Affiliation:
Mechanical and aerospace engineering department, Princeton University, Princeton, NJ 08544
Get access

Abstract

It has been understood for some time that elastic energy can cause surface roughening during a solid surface motion. This instability has recently led to a novel experimental technique to determine stress state on the surface of a solid by measuring the surface profile before and after etching [1]. Along a separate line of investigation, Aziz and co-workers has recently described a different kind of instability, also driven by stress [2]. Their experiments showed that the activation energy of the surface mobility depends linearly on the stress state, and this dependence can cause surface instability. The two kinds of instabilities have very different characteristics. In this paper, we describe a linear stability analysis of a three dimensional interface evolving under stress. The interface can be destabilized either by stress-dependent activation energy or by elastic energy. The implications for the stress measurement technique are discussed. It is suggested that the same experimental procedure be used to measure surface energy and activation strains.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Kim, K.S., Hurtado, J.A. and Tan, H., Evolution of surface-roughness spectrum caused by stress in nanometer-scale chemical etching. Submitted to Phys. Rev. Lett.Google Scholar
2 Barvosa-Carter, W. and Aziz, M.J., Gray, L.J. and Kaplan, T., Phys. Rev. Lett. 81, 1445 (1998).Google Scholar
3 Srolovitz, D.J., Acta Metall. 37, 621 (1989).Google Scholar
4 Mullins, W.W., J. Appl. Phys. 28, 333 (1957).Google Scholar
5 Aziz, M.J., Sabin, P.C. and Lu, G.Q., Phys. Rev B 44, 9812 (1991).Google Scholar
6 Asaro, R.J. and Tiller, W.A., Metall. Trans. 3, 1789 (1972).Google Scholar
7 Yu, H.H. and Suo, Z., J. Appl. Phys. 87, 1211 (2000).Google Scholar