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Interface Of Aluminum/Ceramic Power Substrates Manufactured By Casting-Bonding Process

Published online by Cambridge University Press:  10 February 2011

X. S. Ning ,
Y. Ogawa  and
K. Suganuma
X. S. Ning
Affiliation:
Shiojiri Works, DOWA Mining Co., Ltd., 9637–3 Manaitabara, Kataoka, Shiojiri, Nagano 399–07, Japan
Y. Ogawa
Affiliation:
Central Research Lab., DOWA Mining Co., Ltd., 277–1 Tobuki-Cho, Hachioji, Tokyo 192, Japan
K. Suganuma
Affiliation:
ISIR, Osaka University, 8–1 Mihogaoka, Ibaraki, Osaka 567, Japan suganuma@sanken.osaka-u.ac.jp
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Abstract

New processes for manufacturing Al/ceramic power substrates have been developed. These processes use a casting-bonding method to bond Al plates to the both sides of ceramic plates. The Al plates formed on the substrates are then chemically etched to be a desired shape using the conventional technology, followed by plating nickel on them. The power substrates manufactured by the process have both a perfect interface and an excellent thermal stress tolerance. Hence, these processes are especially suitable for assembling high reliability power devices such as IGBT power modules.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 101
Copyright
Copyright © Materials Research Society 1997

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References

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