Hostname: page-component-78c5997874-xbtfd Total loading time: 0 Render date: 2024-11-19T10:33:56.435Z Has data issue: false hasContentIssue false

Investigation on Morphology and Microstructure of the SALD SiC

Published online by Cambridge University Press:  10 February 2011

Lianchao Sun
Affiliation:
Institute of Materials Science, The University of Connecticut, Storrs, CT 06268-3136
James E. Crocker
Affiliation:
Institute of Materials Science, The University of Connecticut, Storrs, CT 06268-3136
Leon L. Shaw
Affiliation:
Institute of Materials Science, The University of Connecticut, Storrs, CT 06268-3136
Harris L. Marcus
Affiliation:
Institute of Materials Science, The University of Connecticut, Storrs, CT 06268-3136
Get access

Abstract

In this work, the deposition of silicon carbide lines using a tetramethylsilane (TMS) precursor was investigated. Effects of target temperatures on the morphology and crystal structure of the deposits were examined. It was found that the morphology of the SALD SiC depends strongly on the target temperature. The contour of the cross section of the SiC deposits changes from a triangle to trapezoid to volcano shape and the surface morphology of the deposited lines changes from smooth to rough to porous as the target temperature increases. A critical target temperature was found to be about 700°C to initiate deposition of SiC under the current experimental configurations. X-ray diffraction analyses show that the SALD SiC formed at 1000°C contains both crystalline and amorphous phases. The results are briefly discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Kent, R. M. and Ruddell, M. J., JOM, 48, No.9, pp. 3234, (1996).Google Scholar
2. Conley, J. G. and Marcus, H. L., J. of Manufacturing Sci. & Eng., 119, pp. 811816, (1997).Google Scholar
3. Sun, L., Jakubenas, K. J., Crocker, J. E., Harrison, S., Shaw, Leon L. and Marcus, H. L., Solid Freeform Fabrication Proceedings, The University of Texas at Austin, pp. 481488, (1997).Google Scholar
4. Sun, L., Jakubenas, K. J., Crocker, J. E., Harrison, S., Shaw, L. L. and Marcus, H. L., Materials and Manufacturing Processes, 13, No.6, pp. 909919, (1998).Google Scholar
5. Tompkins, J. V., Laabi, R., Birmingham, B. R., and Marcus, H. L., Solid Freeform Fabrication Proceedings, The University of Texas at Austin, pp. 412421, (1994).Google Scholar
6. Siemens D5005 user manual and X-ray software system, Siemens Co.Google Scholar
7. Bäuerle, D., Laser Processing and Chemistry, 2nd Edition, Springer-Verlag Berlin Heidelberg, New York, pp. 108118, (1996).Google Scholar
8. Touloukian, Y. S. and DeWitt, D. P., “Thermophysical Properties of Matter; The TPRC Data Series, Volume 8: Thermal Radiative Properties - Nonmetallic Solids,” lFI/Plenum, New York - Washington, (1972).Google Scholar
9. Figueras, A., Garelik, S., Rodriguez-Clemente, R., Armas, B., Combescure, C. and Dupuy, C., Journal of Crystal Growth, 110, pp. 528542, (1991).Google Scholar
10. Kaelble, E. F., Handbook of X-Rays, McGraw-Hill Book Company, New York, (1967).Google Scholar
11. Suzuki, H., Araki, H., and Noda, T., J. of Materials Science Letters, 13, pp. 4952, (1994).Google Scholar