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Junction Formation in Silicon by Rapid Thermal Annealing

Published online by Cambridge University Press:  22 February 2011

Richard B. Fair
Richard B. Fair*
Affiliation:
MCNC, Center for Microelectronic Systems Technologies, Research Triangle Park, N.C. 27709 Department of Electrical EngineeringDuke University, Durham, N.C. 27706
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Abstract

The feasibility of using isothermal RTA in annealing ion implanted layers for forming junctions has been investigated for the past 10 years. While many of the scientific details surrounding defect formation, transient diffusion and dopant activation remain to be clarified, RTA intrinsically is a viable annealing process which is essential for fabricating advanced silicon devices.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 300: Symposium D1 – III-V Electronic and Photonic Device Fabrication and Performance , 1993 , 545
Copyright
Copyright © Materials Research Society 1993

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