Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-19T12:07:54.789Z Has data issue: false hasContentIssue false
  • English
  • Français

Kinetics of Solid-State Reactions in Ni-Zr Thin Films

Published online by Cambridge University Press:  26 July 2012

R. B. Schwarz  and
J. B. Rubin
R. B. Schwarz
Affiliation:
Center for Materials Science and MST-7, Los Alamos National Laboratory, MS K765, Los Alamos, NM 87545
J. B. Rubin
Affiliation:
Center for Materials Science and MST-7, Los Alamos National Laboratory, MS K765, Los Alamos, NM 87545
Get access

Abstract

We have studied the kinetics of the solid-state amorphizing reaction in thin film multilayers of Ni and Zr. Crystalline Ni and Zr films were deposited in ultra-high vacuum onto platinum resistance thermometers embedded in alumina. An electronic feedback circuit controls the temperature of the substrata by adjusting the power dissipated by the platinum resistors. We find that structural relaxation in the asdeposited Ni and Zr films affects the initial stages of the reaction. For long reaction times there is a discontinuous change in the reaction rate. The time to reach this transition increases with film thickness and depends exponentially on 1/T, with an apparent activation energy of 3 eV atom−1.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 230: Symposium R – Phase Transformation Kinetics in Thin Films , 1991 , 15
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Schwarz, R. B. and Johnson, W. L., Phys. Rev. Lett. 51, 415 (1983).Google Scholar
2. Schwarz, R. B., MRS Bulletin May/June, 55 (1986).Google Scholar
3. Schroder, H. and Samwer, K., J. Mater. Res. 3, 461 (1988).Google Scholar
4. Rossum, M. Van, Nicolet, M.-A., and Johnson, W. L., Phys. Rev. B 29, 5498 (1984).Google Scholar
5. Highmore, R. J., Evetts, J. E., Greer, A. L., and Somekh, R. E., Appl. Phys. Lett. 59, 566 (1987).Google Scholar
6. Unruh, K. M., Meng, W. J., and Johnson, W. L., Mater. Res. Soc. Symp. Proc. 37, 551 (1985).Google Scholar
7. Johnson, W.L., Atzmon, M., Rossum, M. Van, Dolgin, B.P., and Yeh, X.L., in Rapidly Quenched Metals, eds. Steeb, S. and Warlimont, H., (North Holland, Amsterdam, 1985), Vol.5, p. 1515.Google Scholar
8. Pampus, K., Boettinger, J., Torp, B., Schröder, H., and Samwer, K., Phys. Rev. B 35, 7010 (1987).Google Scholar
9. Samwer, K., Schröder, H., and Pampus, K., Mat. Sci. Eng. 97, 63 (1988).Google Scholar
10. Guilmin, P., Guyot, P., and Marchal, G., J. de Physique 46, C8–485 (1985).Google Scholar
11. Schröder, H., Samwer, K., and Koster, U., Phys. Rev. Lett. 54, 197 (1985).Google Scholar
12. Pampus, K., Samwer, K., Boettinger, J., Schröder, H., and Torp, B., Z. Phys. Chem. 157, 251 (1988).Google Scholar
13. Highmore, J. J., Evetts, J. E., Greer, A. L., and Somekh, R. E., Appl. Phys. Lett. 50, 566 (1987).Google Scholar
14. Meng, W. J., Cotts, E. J., Johnson, W. L., Mat. Res. Soc. Symp. Proc. 77, 223 (1987).Google Scholar
15. Rubin, J.B. and Schwarz, R.B., Appl. Phys. Lett. 55, 36 (1989).Google Scholar
16. Rossum, M. Van, Nicolet, M.-A., and Johnson, W.L., Phys. Rev. B29, 5498 (1984).Google Scholar
17. Krebs, H.U. and Samwer, K., Europhys. Lett. 2, 141 (1986).Google Scholar
18. Unruh, K.P., Johnson, W.L., Thakoor, A.P., and Khanna, S.K., Mater. Res. Soc. Symp. Proc. 37, 551 (1985).Google Scholar
19. Platinum Resistance Thermometers, type TFD, from Omega Engineering, Stamford, CT.Google Scholar
20. Hood, G. M. and Schultz, R. J., Acta Metall. 22 459 (1974).Google Scholar
21. Bottiger, J., Dyrbye, K., Pampus, K., and Torp, B., Int. J. Rapid Solidification 2, 191 (1986).Google Scholar
22. Schwarz, R. B. and Rubin, J., J. Sci. Instrum. (submitted, 1991).Google Scholar
23. Cullity, B. D., Magnetic Materials (Addison-Wesley, Reading, MA, 1972), p. 122.Google Scholar
24. Meng, W. J., Nieh, C. W., and Johnson, W. L., Appl. Phys. Lett. 51, 1693 (1987).Google Scholar
25. Schwarz, R. B., Rubin, J. B., and Tiainen, T. J., in Science of Advanced Materials, edited by Wiedersich, H. and Meshii, M. (ASM Intl., Materials Park, OH, 1990), p. 1.Google Scholar
26. Diffusion and Defect Data, eds. Wohlbier, F. and Fischer, D. J. (Trans. Tech., Aedermannsdorf).Google Scholar