Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-26T19:46:25.979Z Has data issue: false hasContentIssue false

Large-Area Wet Micro-Printing (LAMP)for Organic Device Patterning

Published online by Cambridge University Press:  01 February 2011

Hongzheng Jin
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, NJ 08544, USA Princeton Institute for the Science and Technology of Materials (PRISM), Princeton University, Princeton, NJ 08544, USA
James C. Sturm
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, NJ 08544, USA Princeton Institute for the Science and Technology of Materials (PRISM), Princeton University, Princeton, NJ 08544, USA
Get access

Abstract

An important challenge for Organic Light-Emitting Diodes (OLEDs) manufacturing is patterning method of the organic materials used for different colors. In this talk, a Large-Area wet Micro-Printing (LAMP) technique is proposed and demonstrated for organic device patterning. A printing plate is first prepared by surface engineering so that a designed surface energy pattern is achieved. The printing plate is then coated with “ink,” brought into contact the device substrate, and the “ink” is transferred. With this approach, the red (R), green (G) blue (B) sub-pixel arrays needed in a full-color display can be printed in three successive steps, one step for each color. Both single-color pixel arrays and R, G, B sub-pixel arrays have been patterned as a demonstration of the feasibility of this method. The technique has the potential advantages of low-cost and high-throughput and it avoids some of the practical problems associated with the design and operation of an ink-jet apparatus.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Hebner, T.R., Wu, C.C., Marcy, D., Lu, M.H., and Sturm, J.C., Appl. Phys. Lett., 72, 519521 (1998).Google Scholar
2 Shimoda, T., Morii, K., Seki, S., and Kiguchi, H., MRS Bull., 28, 821827 (2003).Google Scholar
3 Darhuber, A.A., Troian, S.M., and Wagner, S., J. Appl. Phys., 90, 36023609 (2001).Google Scholar
4 Miller, S.M., Troian, S.M., and Wagner, S., J. Vac. Sci. Technol., B20, 23202327 (2002).Google Scholar
5 Darhuber, A.A., Valentino, J.P., Troian, S.M., and Wagner, S., J. Microelectromech. Syst., 12, 873879, (2003).Google Scholar
6 Brzoska, J.B., Benazouz, L., and Rondelez, F., Langmuir, 10, 43674373, (1994).Google Scholar
7 Wu, C.C., Sturm, J.C., Register, R.A., Tian, J., Dona, E.P., and Thompson, M.E., IEEE Trans. Elec. Dev. 44, 12691281 (1997).Google Scholar
8 Sirringhaus, H., Kawase, T., Friend, R.H., Shimoda, T., Inbasekaran, M., Wu, W., and Woo, E. P., Science, 290, 21232126 (2000).Google Scholar