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Mechanical Behavior of Eutectic Sn-Ag and Sn-Zn Solders

Published online by Cambridge University Press:  21 February 2011

Hareesh Mavoori ,
Semyon Vaynman ,
Jason Chin ,
Brian Moran ,
Leon M. Keer  and
Morris E. Fine
Hareesh Mavoori
Affiliation:
Dept. of Materials Science & EngineeringNorthwestern University, Evanston, IL 60208
Semyon Vaynman
Affiliation:
Dept. of Materials Science & EngineeringNorthwestern University, Evanston, IL 60208
Jason Chin
Affiliation:
Dept. of Civil EngineeringNorthwestern University, Evanston, IL 60208
Brian Moran
Affiliation:
Dept. of Civil EngineeringNorthwestern University, Evanston, IL 60208
Leon M. Keer
Affiliation:
Dept. of Civil EngineeringNorthwestern University, Evanston, IL 60208
Morris E. Fine
Affiliation:
Dept. of Materials Science & EngineeringNorthwestern University, Evanston, IL 60208
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Abstract

Eutectic Sn-Ag and Sn-Zn solders are currently being investigated as the basis for replacement of Sn-Pb solders. Some mechanical properties of these solder systems - fatigue, tensile, stress relaxation and creep are presented here along with some damage feature observations for eutectic Sn-Ag solder. Semi-empirical modeling, constitutive modeling and numerical simulation based on damage models have been carried out for lifetime prediction. Preliminary agreement of this numerical simulation with experimental results appears encouraging, but the models need further refinement.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 161
Copyright
Copyright © Materials Research Society 1995

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References

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