Published online by Cambridge University Press: 25 February 2011
Recent progress in the growth of thin epitaxial silicides on silicon has resulted in films of very high quality with especially smooth interfaces. Using a completely different technique, high dose implantation followed by annealing, we have succeeded in creating buried single-crystal layers of CoSi2, NiSi2, and CrSi2 in crystalline silicon. The CoSi2 and NiSi2 layers grow in both the (100) and (111) orientations--those in (111) have better crystallinity, but those in (100) are of higher electrical quality. The CrSi2, on the other hand, only grows in the (111) orientation where its hexagonal structure has an almost perfect lattice match to silicon. We call this new internal growth process “mesotaxy” by analogy with epitaxy which refers to single-crystal growth on surfaces.