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Metal / Silicon Multilayers Produced by Low-Temperature MOCVD
Published online by Cambridge University Press: 10 February 2011
Abstract
W/Si and Mo/Si multilayers with 20 periods (doublelayer spacing d = 24nm) were deposited on silicon substrates using (remote-) plasma-enhanced MOCVD. The substrate temperature was below 200°C, which is necessary to avoid interdiffusion of the layers. The layer thickness and growth was controlled by an in situ soft x-ray reflectivity measurement. The characterisation of the multilayers showed an excellent growth of the silicon layers, while the metal layers are rough with embedded crystallites.
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- Copyright © Materials Research Society 1999
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