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Microstructure and Microchemistry of Tungsten and Tungsten Compound Reactions with Aluminum Nitride Substrates

Published online by Cambridge University Press:  21 February 2011

Alistair D. Westwood  and
Michael R. Notis
Alistair D. Westwood
Affiliation:
Department of Materials Science & Engineering, Whitaker Lab #5, Lehigh University, Bethlehem, PA 18015
Michael R. Notis
Affiliation:
Department of Materials Science & Engineering, Whitaker Lab #5, Lehigh University, Bethlehem, PA 18015
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Abstract

A clear understanding of the bonding process in the cofired tungsten-aluminum nitride (W-AIN) metallized system is not currently available. Therefore, in an attempt to obtain a fuller understanding of this process, reactions between metallic W, tungsten trioxide (WO3), and calcium tungstate (CaWO4) with aluminum nitride have been studied using a variety of electron microscopy techniques. The observed reaction was found to be similar in all cases, resulting in the formation of metallic tungsten particles within the AIN substrates. A reaction sequence is proposed to explain adhesion in the W-AIN metallized system; thermodynamic calculations support the proposed reaction sequence. The adhesion in this system is due to both a mechanical fastening by an interlocking and a chemical precipitation reaction. Finally thermal conductivity measurements across the interface have been made to assess the ability of the interface to transfer heat.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 295
Copyright
Copyright © Materials Research Society 1990

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