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Modelling of Failure Time Distributions for Interconnects Due to Stress Voiding and Electromigration

Published online by Cambridge University Press:  10 February 2011

W. G. Wolfer ,
M. C. Bartelt ,
J. J. Dike ,
J. J. Hoyt ,
R. J. Gleixner  and
W. D. Nix
W. G. Wolfer
Affiliation:
Lawrence Livermore National Laboratory, Livermore, CA 94550
M. C. Bartelt
Affiliation:
Sandia National Laboratories, Livermore, CA 94550
J. J. Dike
Affiliation:
Sandia National Laboratories, Livermore, CA 94550
J. J. Hoyt
Affiliation:
Sandia National Laboratories, Livermore, CA 94550
R. J. Gleixner
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
W. D. Nix
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
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Abstract

A status report is given on a comprehensive modeling project aimed at predicting failure time distributions of interconnect lines. We discuss our novel approach to calculate the evolution of stresses in lines using elastic response functions. It is argued that this approach makes it possible to model the stress and damage evolution in a large ensemble of lines efficiently so that statistically meaningful failure time distributions can be generated.

The elastic response functions enable us also to derive a generalized Korhonen equation which includes the effects of mass transport at remote locations. Basic features of this equation are demonstrated with a one-dimensional implementation and its results are compared with the classical Korhonen [8, 9, 10] model.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 516: Symposium E – Low Dielectric Constant Materials IV , January 1998 , 147
Copyright
Copyright © Materials Research Society 1998

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References

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