Hostname: page-component-586b7cd67f-gb8f7 Total loading time: 0 Render date: 2024-11-25T18:46:24.377Z Has data issue: false hasContentIssue false
  • English
  • Français

Moisture and Purity in Polyimide Coatings

Published online by Cambridge University Press:  21 February 2011

A. J. Beuhler ,
M. J. Burgess ,
D. E. Fjare ,
J. M. Gaudette  and
R. T. Roginski
A. J. Beuhler
Affiliation:
Amoco Chemical Company, P. O. Box 400, Naperville, IL 60566
M. J. Burgess
Affiliation:
Amoco Chemical Company, P. O. Box 400, Naperville, IL 60566
D. E. Fjare
Affiliation:
Amoco Chemical Company, P. O. Box 400, Naperville, IL 60566
J. M. Gaudette
Affiliation:
Amoco Chemical Company, P. O. Box 400, Naperville, IL 60566
R. T. Roginski
Affiliation:
Amoco Chemical Company, P. O. Box 400, Naperville, IL 60566
Get access

Extract

Moisture and ionic impurities play a major role in the failure mechanism of integrated devices. [1] The use of organic polymers as microelectronic coatings offers advantages in improved planarization of metal steps, low temperature processibility, and reduction of mechanical stresses. [2] Cited disadvantages are the high inherent moisture absorption and level of impurities. Polymers introduce levels of moisture and impurities 10–100 times greater than vacuum deposited inorganic insulators.[3] Moreover, the combination of ionic impurities and a high humidity environment will degrade attractive polymer properties such as high resistivity and low dielectric constant. [4]

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 73
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Senturia, S.D., Miller, R.A., Denton, D.D., Recent Advances in Polymer Science and Technology, edited by Webber, W.D., Society of Plastics Engineers, Poughkeepsie, N.Y., p.351–361.Google Scholar
2. Kinsman, K.R., Natarajan, B., Thin Solid Films, 166, 83–93 (1988).Google Scholar
3. Pliskin, W.A., Gdula, R.A., Handbook on Semiconductors, edited by Moss, T.S., North-Holland 1980, p. 664.Google Scholar
4. Smith, F.W., Neuhaus, H.J., Senturia, S.D., J. of Electronic Materials, 16, 1, 93–106 (1987).Google Scholar
5. Gordon, S.F., Huffman, W.A., IPC Technical Review, February 1988.Google Scholar
6. Suzuki, H., Sekine, H., Sato, H., Makino, D., Recent Advances in Polymer Science and Technology, edited by Webber, W.D., Society of Plastics Engineers, Poughkeepsie, N.Y. (1987) p. 389–399.Google Scholar
7. Zaikov, G.E., lordanskii, A.P., Diffusion of Electrolytes in Polymers, (VSP BV), (1988), p.55.Google Scholar
8. Beuhler, A.J., Nowicki, N.R., Gaudette, J.M., ACS Polymer Mat. Sci. and Eng., 59 (1988).Google Scholar
9. Sheppard, N.F., Senturia, S.D., Proceedings of 1986 Conference on Electrical Insulation and Dielectric Phenomena, November 1986.Google Scholar
10. ASTM method E104.Google Scholar
11. Brown, C.A., Polymer Materials for Electronic Applications, ACS Symposium Series 184, 1980, p. 151 - 171.Google Scholar
12. Neuhaus, H.J., Day, D.R., Senturia, S.D., J. Electronic Materials, 14, 379 (1985).Google Scholar
13. Bondi, A., J. Phys. Chem. 68, 44 (1964).Google Scholar
14. Bondi, A., Physical Properties of Molecular Crystals, Liquids, and Gases, John Wiley & Sons, New York, N.Y. 1968.Google Scholar
15. Communication with Senturia, S., May 1989.Google Scholar