Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-19T11:56:29.605Z Has data issue: false hasContentIssue false

Nonlinear Micro-Processing of Silicon by Ultrafast Fiber Laser at 1552 nm

Published online by Cambridge University Press:  19 September 2011

Yoshiro Ito
Affiliation:
Department of Mechanical Engineering, Nagaoka University of Technology, Kamitomioka, Nagaoka, Niigata 940-2188, Japan
Rie Tanabe
Affiliation:
Department of Mechanical Engineering, Nagaoka University of Technology, Kamitomioka, Nagaoka, Niigata 940-2188, Japan
Kozo Tada
Affiliation:
Citizen Finetech Miyota, 353, Yaehara, Tomi, Nagano 289-0406, Japan
Get access

Abstract

Processing of transparent materials by non-linear absorption mechanisms induced by short pulse lasers has been applied in many fields. Silicon (Si) is widely used materials in microelectronics, MEMS and photonics. It is, however, not transparent for commonly used processing lasers in near infrared to ultraviolet spectral range and has not been a subject for the non-linear processing by lasers so far. In this paper, possibilities and capabilities of non-linear processing of Si by 900 fs, 1552nm laser radiation are described with special emphasis on application to frequency adjustment of a crystal oscillator in a package made from Si.

Type
Research Article
Copyright
Copyright © Materials Research Society 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Japan Patent 2009-124310, 2009-246188 Google Scholar
2. Ito, Y., Sato, F., Shinohe, Y., Tanabe, R., and Tada, K., Proc. SPIE Vol. 7584, 75840M (Feb. 17, 2010)Google Scholar
3. Tanabe, R., Sato, F., Shinohe, Y., Tada, K. and Ito, Y., Proc of LPM2010, #10-25 (2010) http://www.jlps.gr.jp/en/proc/lpm/10/ Google Scholar
4.See for example, Shur, M., ‘Physics of Semiconductor Devices’, Prentice-Hall Inc., New Jersy, (1990) p478 Google Scholar
5. Atsumi, K.: The Japan Society of Mechanical Engineers, No. 1068, Vol. 110, 1416 (2007) (in Japanese)Google Scholar
6. Fukuyo, F., Fukumitsu, K., and Uchiyama, N., “The stealth dicing technologies and their application”, Proceedings of LPM 2005 (2005)Google Scholar
7. Fukumitsu, K., Kumagai, M., Ohmura, E., Morita, H., Atsumi, K. and Uchiyama, N., “The mechanism of semiconductor wafer dicing by stealth dicing technology”, Proceedings of LAMP2006 (2006)Google Scholar
8. Ohmura, E., Kumagai, M., Fukumitsu, K., Nakano, M., Uchiyama, N. and Morita, H., “Internal modification of ultra thin silicon wafer by permiable pulse laser”, Journal of the Japan Society for Precision Engineering, 74(3), 275281, (2008), and references therein. (in Japanese) Google Scholar