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Numerical Analysis of the Ball Forming Process in Copper Ball Bonding

Published online by Cambridge University Press:  15 February 2011

Fang Hongyuan ,
Qian Yiyu  and
Jiang Yihong
Fang Hongyuan
Affiliation:
Doctor, Harbin Institute of Technology, Dept. of Welding, Harbin, The People's Republic of China.
Qian Yiyu
Affiliation:
Professor, Harbin Institute of Technology, Dept. of Welding, Harbin, The People's Republic of China.
Jiang Yihong
Affiliation:
Professor, Harbin Institute of Technology, Dept. of Welding, Harbin, The People's Republic of China.
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Abstract

In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical analysis. By means of calculation of temperature field, speed field and displacement field for ultrafine copper wire under a miniarc, the regular pattern of copper wire ball formation has been clarified. In this paper, the calculating result of displacement field has also been tested and verified.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 225: Symposium G – Materials Reliability Issues in Microelectronics , 1991 , 199
Copyright
Copyright © Materials Research Society 1991

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References

Referance

1. Christensce, H., Bell Lab. Record; 1958.8; P.127–131.Google Scholar
2. Lepsolter, M.P., Machonald, R.W.; Electronic Devices Meeting, 1984.Google Scholar
3. Matcovich, T.J.; Trans in Bonding Technology, IEEE; 1981, P.24–30.Google Scholar
4. Anderson, O.L., Christence, H., Adreatch, P.;J.Appl. Physics;1969.8.P.923.Google Scholar
5. Markstoin, H.W.; Electronic Packing and Production; 1984.2. P. 88–02.Google Scholar
6. Clatterbamgh, G.V.; 34th Electronic Components Conf.;1984. P.21–30.Google Scholar
7. Hirota, J.; 35th Electronic Components Conf.; 1985.Google Scholar
8. U.S. Patent, 4390771. 1983.6.Google Scholar
9. Hitachi Ldt.;U.K. Patent Application 2157607A, 1985.10.Google Scholar
10. Hongyuan, Fang. PhD thesis, Harnin Institute of Technology,1990.Google Scholar