Hostname: page-component-78c5997874-fbnjt Total loading time: 0 Render date: 2024-11-18T21:22:21.875Z Has data issue: false hasContentIssue false

On factors affecting the extraction of elastic modulus by nanoindentation of organic polymer films

Published online by Cambridge University Press:  01 February 2011

F. Iacopi
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
M. Laknin
Affiliation:
Faculté des Sciences et Techniques, Université d'Aix et Marseille, France
A. Mulloy
Affiliation:
Materials Science Dept., Trinity College, Dublin, Ireland
J.M.J. den Toonder
Affiliation:
Philips Research Laboratories, Prof. Holstlaan 4, 5656 AA Eindhoven, The Netherlands
D. Vanhaeren
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
S. H. Brongersma
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
Get access

Abstract

A detailed study of nanoindentation in Continuous Stiffness Mode (CSM) on a family of aromatic thermosetting polymers is carried out to identify the causes for the large variability in the extracted values of the elastic modulus of organic polymer films.

It is shown that the variation of parameters determining the dynamics of the force application such as the CSM frequency, the actual strain or load rate, and the duration of the waiting time segments can lead up to 20% difference in the estimated elastic modulus. The reason for this is related to creep, more specifically to viscoelastic behaviour, typical of organic films. On the other hand, pile-up is shown to have a negligible effect on the extraction of the elastic modulus from indentation depths below 50% of the film thickness, even for films with hardness as low as 0.13GPa. It is also concluded that neither pile-up nor creep phenomena can account for the overestimation of the elastic modulus with nanoindentation as compared to the values extracted with the surface acoustic waves technique.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tsui, T., Pharr, G.M., J. Mater.Res. 14 (1), 1999 Google Scholar
2. Brongersma, S.H., 3rd European Symposium on nano-mechanical testing, 2003 Hueckelhoven, Germany.Google Scholar
3. Abell, T., Iacopi, F., Prokopowicz, G., Sun, B., Mazurenko, A., Travaly, Y., Baklanov, M., Sullivan, C., Brongersma, S., Liou, H-C., Tower, J., Gostein, M., Gallagher, M., Calvert, J., Moinpour, M., Maex, K., proc. of Advanced Metallization Conference 2004, S. Diego, Ca., USA.Google Scholar
4. Shen, L., Zeng, K., Microelectron.Eng. 71, pp.221228, 2004.Google Scholar
5. Mills, N.J., Plastics: Microstructure, properties and applications, E. Arnold Publishers, London, 1986.Google Scholar
6. Briscoe, B.J., Fiori, L., Pelillo, E., J Phys D: Appl. Phys 31, pp 23952405, 1998.Google Scholar
7. Martin, S.J., Godschalx, J.P., Mills, M.E., Shaffer, E.O., Townsend, P.H., Advanced Materials 12 (23), pp.17691778, 2000.Google Scholar
8. Maex, K., Baklanov, M.R., Shamiryan, D., Iacopi, F., Brongersma, S., Yanovitskaya, Z.S., J. Appl.Phys. 93 (11), pp.87938841, 2003.Google Scholar
9. Dow Chemical public communications, http://www.dow.com/silk/silky Google Scholar
10. Lucas, B.N., Oliver, W.C., Swinderman, J.E., MRS Fall Meeting, Fundamentals of Nanoindentation and Nanotribology Symp., San Francisco, CA, USA, 1317 April 1998 Google Scholar
11. Neubrand, A., Hess, P., J. Appl.Phys. 71 (1), pp.227238, 1992.Google Scholar
12. Iacopi, F., Brongersma, S.H., Mulloy, A., den Toonder, J.M.J., Maex, K., submitted to Applied Physics Letters, nov.2004.Google Scholar
13. Deriano, S., Jarry, A., Rouxel, T., Sangleboeuf, J.-C., Hampshire, S., J.of Non-Crystalline Solids 344 (1–2), pp.4450, 2004.Google Scholar