Hostname: page-component-586b7cd67f-rdxmf Total loading time: 0 Render date: 2024-11-27T04:07:49.041Z Has data issue: false hasContentIssue false

Patterning Submicron Features on Flexible Plastic Substrates by Optical Lithography

Published online by Cambridge University Press:  01 February 2011

Mária Péter
Affiliation:
maria.peter@tno.nl, TNO-Netherlands Organisation for Applied Scientific Research, Holst Centre, High Tech Campus 31, Eindhoven, 5656 AE, Netherlands, +31402774081, +31402746400
Wim de Laat
Affiliation:
wim.de.laat@asml.com, ASML Netherlands B.V., Customized Imaging Solutions, De Run 6501, 5504 DR Veldhoven, Netherlands
Peter T. M. Giesen
Affiliation:
peter.giesen@tno.nl, TNO-Netherlands Organisation for Applied Scientific Research, Holst Centre, High Tech Campus 31, 5656 AE Eindhoven, Netherlands
Cheng-Qun Gui
Affiliation:
cheng.gui@asml.com, ASML Netherlands B.V., Customized Imaging Solutions, De Run 6501, 5504 DR Veldhoven, Netherlands
Erwin R. Meinders
Affiliation:
erwin.meinders@tno.nl, TNO-Netherlands Organisation for Applied Scientific Research, Holst Centre, High Tech Campus 31, 5656 AE Eindhoven, Netherlands
Get access

Abstract

Manufacturing transistors on thin flexible polymer foils is challenging and differs from standard Si processing due to the dimensional instability of the substrate influenced by moisture uptake, temperature and handling. A thorough analysis of material properties of the tested foil was performed to understand its behavior during lithography and subsequently to improve the processing. Imaging experiments on 100 µm polyethylene naphthalate (PEN) foils were performed with a PAS 5500/100D ASML step and repeat I-line (365 nm) system equipped with reticles having features of several microns and also sub-micrometer dimensions. A foil lamination process was developed to improve the dimensional stability during processing and to achieve a good surface flatness crucial for sub-micrometer imaging. The optimum process window for sub-micrometer critical dimensions was determined by performing a Focus Exposure Matrix (FEM) experiment in which the energy and focus were increased stepwise. The optimum imaging conditions were derived from SEM analysis. The results indicated a reproducible and good patterning accuracy for making patterns below 1µm size.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Vaeth, K. M., Inform. Display 19, 12 (2003).Google Scholar
2. Gundlach, D. J., Lin, Y. Y., Jackson, T. N., IEEE Electron. Dev. Lett. 18, 87 (1997).10.1109/55.556089Google Scholar
3. Shtein, M., Mapel, J., Benziger, J. B., Forrest, S. R., Appl. Phys. Lett. 81, 268 (2002).10.1063/1.1491009Google Scholar
4. Peumans, P., Forrest, S. R., Appl. Phys. Lett. 79, 126 (2001).Google Scholar
5. Peumans, P., Uchida, S., Forrest, S. R., Nature 425, 158 (2003).Google Scholar
6. Gans, B. J. de, Duinveld, P. C., Shubert, U. S., Adv. Mater. 16, 203 (2004).10.1002/adma.200300385Google Scholar
7. Blanchet, G., Rogers, J., J. Imaging Sci. Technol. 47, 296, (2003).Google Scholar
8. Mills, C. A., Martinez, E., Bessueille, F., Villanueva, G., Bausells, J., Samitier, J., Errachid, A., Microelectronic Eng. 78–79, 695 (2005).10.1016/j.mee.2004.12.087Google Scholar
9. Giesen, P.T.M. et al. , Experimental characterization of in-plane deformation of flexible substrates for optical lithography using a novel experimental setup, OEC 2007Google Scholar