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A Perturbation-Based Method for Extracting Elastic Properties during Spherical Indentation of an Elastic Film/Substrate Bilayer

Published online by Cambridge University Press:  01 February 2011

Jae Hun Kim ,
Andrew Gouldstone  and
Chad S. Korach
Jae Hun Kim
Affiliation:
jkim13@bidmc.harvard.edu, Stony Brook University, Materials Science and Engineering, Stony Brook, New York, United States
Andrew Gouldstone
Affiliation:
bubbleraft@gmail.com, Northeastern University, Mechanical and Industrial Engineering, Boston, Massachusetts, United States
Chad S. Korach
Affiliation:
ckorach@notes.cc.sunysb.edu, Stony Brook University, Mechanical Engineering, Stony Brook, New York, United States
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Abstract

Accurate mechanical property measurement of films on substrates by instrumented indentation requires a solution describing the effective modulus of the film/substrate system. Here, a first-order elastic perturbation solution for spherical punch indentation on a film/substrate system is presented. Finite element method (FEM) simulations were conducted for comparison with the analytic solution. FEM results indicate that the new solution is valid for a practical range of modulus mismatch, especially for a stiff film on a compliant substrate.

Keywords

thin filmelastic propertiesmicroelectro-mechanical (MEMS)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1139: Symposium GG – Microelectromechanical Systems–Materials and Devices II , 2008 , 1139-GG03-42
Copyright
Copyright © Materials Research Society 2009

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References

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