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Physical Characteristics of Very Low Temperature Anodic Oxides of Polycrystalline Si Films
Published online by Cambridge University Press: 10 February 2011
Abstract
Controlled oxidation of polycrystalline and single crystal silicon has been carried out at temperatures < 100 °C using microwave excited, plasma assisted anodisation. Oxide thicknesses up to 30 nm have been obtained in times ∼ 15 minutes. The growth kinetics are similar for both types of Si. The results of infrared absorption measurements clearly indicate that the anodic oxides have a network structure significantly different to that of high temperature, thermally grown oxides and this is partly due to ultra-violet radiation present in the plasma during growth. Electrical measurements (CV, IV) are underway on simple MOS capacitors. The results indicate that the plasma oxides have acceptable levels of fixed oxide charge but that the breakdown electric fields are presently low. Preliminary data suggests that these very low temperature oxides are suitable for TFT applications though some technical problems need to be addressed. Given these reservations the processing of large area flat panel displays using this type of plasma assisted oxidation is perfectly feasible.
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- Copyright © Materials Research Society 2000