Published online by Cambridge University Press: 21 February 2011
Sputtered multilayer samples of W and Cu have been prepared on a variety of substrates with nominal individual layer thicknesses ranging from about 5 to about 100 A. High angle X-Ray Diffraction (XRD) data have been obtained at room temperature on all of these samples. In addition, selected samples have been studied by Transmission Electron Microscopy (TEM) and by low and high angle XRD from room temperature to above the melting point of bulk Cu. XRD and TEM data indicate that the as-deposited multilayer samples are comprised of well-defined individual layers due, in part, to the very small mutual solubility of W and Cu. At high temperatures the existence of low angle scattering peaks as well as satellites about Bragg peaks indicates that the layered structure is not lost. As a result, the W-Cu multilayer system seems to be an interesting candidate for the study of the melting behavior of thin Cu layers.
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