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Preparation and Structure of Cu-W Multilayers

Published online by Cambridge University Press:  21 February 2011

K. M. Unruh
Affiliation:
Department of Physics and Astronomy, University of Delaware, Newark, DE 1716.
B. M. Patterson
Affiliation:
Department of Physics and Astronomy, University of Delaware, Newark, DE 1716.
S. I. Shah
Affiliation:
Central Research and Development Department, Experimental Station, E.I. du Pont de Nemours and Co., Wilmington, DE 19880.
G. A. Jones
Affiliation:
Central Research and Development Department, Experimental Station, E.I. du Pont de Nemours and Co., Wilmington, DE 19880.
Y.-W. Kim
Affiliation:
Department of Materials Science, the Coordinaated Science Laboratory, and the Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, II 61801.
J. E. Greene
Affiliation:
Department of Materials Science, the Coordinaated Science Laboratory, and the Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, II 61801.
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Abstract

Sputtered multilayer samples of W and Cu have been prepared on a variety of substrates with nominal individual layer thicknesses ranging from about 5 to about 100 A. High angle X-Ray Diffraction (XRD) data have been obtained at room temperature on all of these samples. In addition, selected samples have been studied by Transmission Electron Microscopy (TEM) and by low and high angle XRD from room temperature to above the melting point of bulk Cu. XRD and TEM data indicate that the as-deposited multilayer samples are comprised of well-defined individual layers due, in part, to the very small mutual solubility of W and Cu. At high temperatures the existence of low angle scattering peaks as well as satellites about Bragg peaks indicates that the layered structure is not lost. As a result, the W-Cu multilayer system seems to be an interesting candidate for the study of the melting behavior of thin Cu layers.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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References

REFERENCES

1) Dirks, A.G. and Broek, J.J. van den, J. Vac. Sci. Technol. A3, 2618 (1985).Google Scholar
2) Natasi, M., Saris, F.W., Hung, L.S., and Mayer, J.W., J. Appl. Phys. 58, 3052 (1985).Google Scholar
3) Westendorp, J.F.M., Littmark, U., and Saris, S.W., Nucl. Instrum. Meth. B13, 54 (1986).CrossRefGoogle Scholar
4) Shunk, F.A., Composition of Binary Alloys, Second Supplement (McGraw-Hill, New York, 1969).Google Scholar
5) Schuller, I.K., Phys. Rev. Lett. 44, 1597 (1980).Google Scholar
6) Sevenhans, W., Vanderstraeten, H., Locquet, J.-P., Bruynseraede, Y., Homma, H., and Schuller, I.K., (preprint) to appear in Mat. Res. Soc. Sym. Proc. 1988.Google Scholar
7) Sevenhans, W., Locquet, J.-P., Bruynseraede, Y., Homma, H., and Schuller, I.K., Phys. Rev. B38, 4974 (1988).Google Scholar
8) Willens, R.H., Kornblit, A., Testardi, L.R., and Nakahara, S., Phys. Rev. B25, 290 (1982).Google Scholar
9) Devoud, G. and Willens, R.H., Phys. Rev. Lett. 57, 2683 (1986).CrossRefGoogle Scholar
10) See e.g. McWhan, D.B., in Synthetic Modulated Structures, edited by Chang, L.Y. and Giessen, B.C. (Academic Press, Inc., Orlando, 1985), Chapter 2.Google Scholar