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Processing of Clay/Epoxy Nanocomposites with A Three-Roll Mill Machine

Published online by Cambridge University Press:  11 February 2011

Asma Yasmin ,
Jandro L. Abot  and
Isaac M. Daniel
Asma Yasmin
Affiliation:
Center for Intelligent Processing of Composites, Northwestern University, Evanston, IL 60208–3040, U.S.A.
Jandro L. Abot
Affiliation:
Center for Intelligent Processing of Composites, Northwestern University, Evanston, IL 60208–3040, U.S.A.
Isaac M. Daniel
Affiliation:
Center for Intelligent Processing of Composites, Northwestern University, Evanston, IL 60208–3040, U.S.A.
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Abstract

In the present study, a three-roll mill machine was used to disperse/exfoliate the nanoclay particles in an epoxy matrix. The compounding process was carried out with varying mixing time and concentrations of clay particles (1 to 10 wt.%). It was found that the longer the mixing time, the higher the degree of intercalation. Mechanical properties, XRD and TEM were used to characterize the nanocomposites. Elastic modulus was found to increase with increasing clay content, however, the tensile strength was not found to vary accordingly. Compared to conventional direct and solution mixing techniques, the compounding of clay/epoxy nanocomposites by a three-roll mill was found to be highly efficient in achieving higher levels of intercalation/exfoliation in a short period of time and also environmentally friendly.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 740: Symposium I – Nanomaterials for Structural Applications , 2002 , I3.7
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

1. Wang, Z., and Pinnavaia, T.J., Chem. Mater. 10, 3769 (1998).Google Scholar
2. Vaia, R.A., Ishii, H. and Giannelis, E.P., Chem. Mater. 5, 1694 (1993).Google Scholar
3. Wei, C.L., Zhang, M.Q., Rong, M.Z. and Friedrich, K., Comp. Sci. Tech., 62, 1327 (2002).Google Scholar
4. Jiankun, L., Yucai, K., Zongneng, Q., and Xiao-Su, Y., J. Polym. Sci: Part B, 39, 115 (2001).Google Scholar
5. Zerda, A.S., and Lesser, A.J., J. Polym. Sci: Part B, 39, 1137 (2001)Google Scholar
6. LeBaron, P.C., Wang, Z., and Pinnavaia, T.J., J. App. Clay Sci., 15, 11 (1999).Google Scholar
7. Kornmann, X., Lindberg, H., and Berglund, L.A., Polymer 42, 1303 (2001).Google Scholar
8. Vaia, R.A., Jandt, K.D., Kramer, E.J. and Giannelis, E.P., Chem. Mater., 8, 2628 (1996).Google Scholar
9. Nam, P.H., Maiti, P., Okamoto, M., Kotaka, T., Hasegawa, N. and Usuki, A., Polymer, 42, 9633 (2001).Google Scholar
10. Liu, X. and Wu, Q., Polymer, 42, 10013 (2001).Google Scholar
11. Fornes, T.D., Yoon, P.J., Keskkula, H. and Paul, D.R., Polymer, 42, 9929 (2001).Google Scholar
12. Nanocor, Inc., Technical data.Google Scholar
13. Yasmin, A., Unpublished work.Google Scholar