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Properties of Amorphous Silicon Films Deposited at Rates Higher Than 1 μM/MIN.
Published online by Cambridge University Press: 28 February 2011
Abstract
The thermal decomposition of disilane in a helium flow has been used for the deposition of hydrogenated amorphous sil icon (a-Si:H) films on various substrates at rates higher than 1 μm/min, and a-SI:H films with thickness up to 20 μm have been deposited in this manner. Their optical properties, photoconductivity, minority carrier diffusion length, gap state density, etc., have been measured. The electronic properties of these films are superior to those of chemical vapor deposited a-Si:H films heretofore reported, indicating that the thermal decomposition of disilane in a hel ium atmosphere is a promising technique for the deposition of a-SI:H films.
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