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Quantitative Modeling and Measurement of Copper Thin Film Adhesion

Published online by Cambridge University Press:  15 February 2011

A.A. Volinsky ,
N.I. Tymiak ,
M.D. Kriese ,
W.W. Gerberich  and
J.W. Hutchinson
W.W. Gerberich
Affiliation:
University of Minnesota, Dept. of Chem. Engineering and Materials Science, Minneapolis, MN
J.W. Hutchinson
Affiliation:
Harvard University, Division of Engineering and Applied Sciences, Cambridge, MA
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Abstract

Numerous mechanisms have been identified as fundamental to the adhesion of thin metallic films. The primary mechanism is the thermodynamic work of adhesion of the interface, which in its most basic description is the difference between the surface energies of the two materials and that of the interface. This quantity is often described as leveraging the contributions of other mechanisms. One of the more important mechanisms is that of plasticity occurring in a process zone in the vicinity of the delamination boundary. A quantitative model to characterize the contributions of plastic energy dissipation has been developed and used to rationalize experimental adhesion assessments. This model incorporates the functional dependence of the film thickness and constitutive properties. Orders of magnitude increases in the practical work of adhesion were both observed and predicted. Experimentally, the films used for model comparison were sputter-deposited copper ranging from 40 to 3300 nm in thickness, with and without a thin 10 nm Ti underlayer. Nanoindentation induced delamination of the Cu from SiO2/Si wafers were evaluated in the context of composite laminate theory to determine adhesion energies ranging from 0.6 to 100 J/m2 for bare Cu and from 4 to 110 J/m2 for Cu with the Ti underlayer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 539: Symposium M – Fracture & Ductile vs. Brittle Behavior - Theory, Modelling… , 1998 , 277
Copyright
Copyright © Materials Research Society 1999

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References

1. Wei, Y. and Hutchinson, J.W., J.Mech.Phys.Solids, (1997), 45, pp. 1137–1159 Google Scholar
2. Drory, M.D. and Hutchinson, J.W., Proc. R. Soc. Lond. A. (1996) 452, pp. 2319–2341 Google Scholar
3. He, M.Y., Evans, A.G. and Hutchinson, J.W., Acta Metall. Mater., 1996, Vol. 44, pp. 2963–71Google Scholar
4. Tvergaard, V., Hutchinson, J.W., J.Mech.Phys.Solids, (1996), 44, pp. 789–800 Google Scholar
5. Tymiak, N.I., Volinsky, A.A., Kriese, M.D., Downs, S.A. and Gerberich, W.W., submitted to Metallurgical Transactions, 1998 Google Scholar
6. Gerberich, W.W., Kramer, D.E., Tymiak, N.I., Volinsky, A.A., Bahr, D.F. and Kriese, M.D., submitted to Acta Metall. Mater., 1998 Google Scholar
7. Dauskardt, R.H., Lane, M., Ma, Q., Submitted to Engineeing Fracture Mechanics, 1997 Google Scholar
8. Stoney, G.G., Proc.Roy.Soc.Lond. A82 (1909) p. 72 Google Scholar
9. Kriese, M.D., Moody, N.R. and Gerberich, W.W., Acta Metall., 1998 Google Scholar
10. Bagchi, A. and Evans, A. G., Thin Solid Films, (1986), 286, pp. 203–12Google Scholar
11. Vlassak, J.J., Drory, M.D. and Nix, W.D., J. Mater. Res., (1997), 12, No 7, p. 1900–10Google Scholar
12. Marshall, D.B. and Evans, A.G., J. Appl. Phys., 1984, 56, pp. 2632–38Google Scholar
13. Wu, T., J. Mater. Res., (1991), 6 No. 2, pp. 407–426 Google Scholar
14. Oliver, W.C. and Pharr, G.M., J. Mater. Res., 7, (1992), pp.1564–1583 Google Scholar
15. Stringfellow, R.G. and Freund, L.B., Int.J.Solids Structures, 30 (1993), 239, pp. 1379–1395 Google Scholar
16. Shacham-Diamand, Y., Dedhia, A., Hoffstetter, D. and Oldham, W.G., J. Electrochem. Soc., 140 (1993), p. 93 Google Scholar
17. Russell, S.W., Raflaski, S.A., Spreitzer, R.L., Li, J., Moinpour, M., Moghadam, F., Alford, T.L., Thin Solid Films 262 (1995), pp. 154–167 Google Scholar
18. McClintock, F.A. and Irwin, G.R., Plasticity Aspects of Fracture Mechanics, Fracture Toughness Testing and its Applications, ASTM STP 381, Philadelphia, 1965, pp. 84–113 Google Scholar
19. Mao, S.X. and Evans, A.G., Acta Mater., 45 (1997), 4263–4270 Google Scholar
20. Yokobori, A.T., Yokobori, T.Y. and Nioshi, H., in Macro-and Micro-Mechanics of High Velocity Deformation and Fracture, IUTAM Symposium, Tokyo, 1985, Springer-Verlag, Berlin (1987)Google Scholar
21. Hutchinson, J.W., Thouless, M.D. and Linger, E.G., Acta Metall.Mater., 40 (1992), pp. 295–308 Google Scholar