Hostname: page-component-7479d7b7d-8zxtt Total loading time: 0 Render date: 2024-07-11T05:21:02.236Z Has data issue: false hasContentIssue false

Quantum Size Effect in Polysilicon Gates

Published online by Cambridge University Press:  22 February 2011

N. Lifshitz
Affiliation:
AT&T Bell Laboratories Murray Hill, New Jersey 07974
S. Laryi
Affiliation:
AT&T Bell Laboratories Murray Hill, New Jersey 07974
T. T. Sheng
Affiliation:
AT&T Bell Laboratories Murray Hill, New Jersey 07974
Get access

Abstract

It has been observed by several authors that metal-oxide-semiconductor devices with polycrystalline Si (polySi) gates behave differently depending on the doping species in polySi: the work-function difference between the silicon substrate and the gate (øps) is higher when the gates are doped with arsenic than when they are doped with phosphorus.

We believe that the different behavior of øps. can be explained by different grain textures at the polySi/SiO2 interface. Our transmission electron microscoey of the films indicates that while P-doped material consists of large (≈3000Å) grains, As-doped polySi preserves its as-deposited columnar structure – even after a high temperature anneal. Moreover, at the interface with the gate oxide an as-deposited microstructure with very small (≈100Å) “embrionic” grains is preserved. On the basis of these observations, we suggest a model for the different behavior of ø ps. The model is based on a quantum-size effect which becomes important for such small grain dimensions at the interface in As-doped polySi. This effect drastically reduces the number of states available in the conduction band at low energies. The resulting shift of the Fermi level provides a qualitative explanation for the observed puzzling difference between the work-functions of Asand P- doped polySi.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Nicollian, E. H., Brews, J. R., ”MOS Physics and Technology,” John Wiley & Sons, N.Y., 1982.Google Scholar
2. Lifshitz, N., IEEE Trans. on Electron Devices, ED–32, 617 (1985).Google Scholar
3. Lifshitz, N., J. of Electochem. Soc., 130, 2464 (1983).CrossRefGoogle Scholar
4. Angelucci, R., Severi, M. and Solmi, S., Mater. Chem. and Phys., 9, 235 (1983).Google Scholar
5. Lee, D. S. and Fossum, J. O., IEEE Trans. on Electron Devices, ED–30, 626 (1983).Google Scholar
6. Mandurah, M. M., Saraswat, K. S., Helms, C. R. and Kamins, T. I., J. Appl. Phys., 51, 5755 (1980).Google Scholar
7. Matard, H. F., J. Appl. Phys., 56, 2605 (1984).Google Scholar
8. Lu, N. C. C., Gerzberg, L., Lu, C. Y. and Meindl, J. D., IEEE Trans. on Electron Devices, ED–30, 137 (1983).Google Scholar
9. Kim, D. M., Krondeker, A. N., Ahmed, S. S. and Shah, R. R., IEEE Trans. on Electron Devices, ED–31, 480 (1984).Google Scholar
10. M Mandurah, M., Saraswat, K. S. and Kamins, T. I., IEEE Trans. on Electron Devices, ED–28. 1171 (1981).Google Scholar
11. Avid, Kamgar and Hillenius, S. J., Appl. Phys. Lett., 51(16), 1251 (1987).Google Scholar