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Residual Stresses and Damage in Multilayer Ceramic/Metal Packages

Published online by Cambridge University Press:  25 February 2011

A. G. Evans  and
C. H. Hsueh
A. G. Evans
Affiliation:
Materials Program College of Engineering University of California Santa Barbara, CA 93106
C. H. Hsueh
Affiliation:
Materials Program College of Engineering University of California Santa Barbara, CA 93106
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Abstract

Multilayer ceramic/metal modules are subject to stresses that develop both upon co-sintering and upon cooling. The sources and magnitudes of these stresses are described and discussed. The co-sintering induced stresses derive from densification-rate mismatch and can be analyzed in terms of constitutive laws that describe the densification and creep of partially dense ceramic and metal bodies. Cooling induced stresses are associated with thermal contraction mismatch and are strongly influenced by the plastic flow laws for porous metals. Typical stresses produced during co-sintering and cooling are calculated and techniques for minimizing such stresses are discussed and analyzed. Mechanical damage, manifest as brittle cracks and creep cracks, are also described and analyzed. Critical values of material parameters that exclude extensive crack damage are then emphasized, based on models of crack propagation.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 91
Copyright
Copyright © Materials Research Society 1986

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References

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