Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-21T21:39:10.585Z Has data issue: false hasContentIssue false

Schottky Barrier Height Engineering in NiGe/n-Ge(001) Contacts by Germanidation Induced Dopant Segregation

Published online by Cambridge University Press:  01 February 2011

S. L. Liew
Affiliation:
sl-liew@imre.a-star.edu.sg, IMRE, OESC, 3 Research Link, Singapore, N/A, Singapore
C. T. Chua
Affiliation:
ct-chua@imre.a-star.edu.sg, Institue of Materials Research and Engineering, 3 Research Link, Singapore, 117602, Singapore
D. H. L Seng
Affiliation:
debbie-seng@imre.a-star.edu.sg, Institue of Materials Research and Engineering, 3 Research Link, Singapore, 117602, Singapore
D. Z. Chi
Affiliation:
dz-chi@imre.a-star.edu.sg, Institue of Materials Research and Engineering, 3 Research Link, Singapore, 117602, Singapore
Get access

Abstract

Schottky barrier height (ÖB) engineering of NiGe/n-Ge(001) diodes was achieved through germanidation induced dopant segregation on As implanted-Ge substrates.was reduced from 0.55 eV to 0.16 eV with increasing As dose on n-Ge(001) while on p-Ge(001), the diodes exhibited increasing ÖB.

Keywords

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Trumbore, F. A., Bell Syst. Tech. J. 39, 205 (1960).Google Scholar
2. Stolwijk, N. A., in Impurities and Defects in Group IV Elements and III-V Compounds, edited by Schulz, M., Landolt-Börnstein, , New Series, Group III, Vol. 22A (Springer, Berlin, 1989).Google Scholar
3. Chi, D. Z., Lee, R. T. P., Chua, S. J., Lee, S. J., Ashok, S., and Kwong, D.-L., J. Appl. Phys. 97, 113706 (2005).Google Scholar
4. Lee, K. Y., Liew, S. L., Chua, S. J., Chi, D. Z., Sun, H. P., and Pan, X. Q., Mater. Res. Soc. Symp. Proc. 810, 55 (2004).Google Scholar
5. Yao, H. B., Tan, C. C., Liew, S. L., Chua, C. T., Chua, C. K., Li, R., Lee, R. T. P., Lee, S. J., and Chi, D.Z., Extended Abstracts of the Sixth International Workshop on Junction Technology (IWJT), China, pp. 164 (2006).Google Scholar
6. Shannon, J. M., Solid-State Electronics 19, 537 (1976).Google Scholar
7. Sze, S. M., Physics of Semiconductor Devices (p293297), (Wiley, New York, 1981).Google Scholar
8. Kinoshita, Y. Tsuchiya, Yagishita, A., Uchida, K., 2004 Symposium on VLSI Technology, p168.Google Scholar
9. Zhang, M., Knoch, K., Zhao, Q. T., Lenk, St., Breuer, U., and Mantl, S., Proceedings of ESSDERC, (Grenoble, France, 2005) p457.Google Scholar
10. Chui, Chi On, Kulig, Leonard, Moran, Jean, and Tsai, Wilman, and Sarawat, Krishna C., APL. 87, 091909 (2005).Google Scholar