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Studies of Sputter Deposited CU1-XTAX Alloys

Published online by Cambridge University Press:  15 February 2011

Hong Wang ,
M. J. Zaluzec ,
Y. Liu ,
J. Mazumder  and
J. M. Rigsbee
Hong Wang
Affiliation:
Department of Materials Science and Engineering, University of Illinois, 1304 West Green Street, Urbana, IL 61801;
M. J. Zaluzec
Affiliation:
Ford Scientific Research Laboratory, MD2313, 2000 Rotunda Road, Dearborn, MI 48121;
Y. Liu
Affiliation:
Department of Mechanical and Industrial Engineering, 1206 West Green Street, Urbana, IL 61801
J. Mazumder
Affiliation:
Department of Mechanical and Industrial Engineering, 1206 West Green Street, Urbana, IL 61801
J. M. Rigsbee
Affiliation:
Department of Materials Science and Engineering, University of Illinois, 1304 West Green Street, Urbana, IL 61801; now at Department of Materials Science and Engineering, University of Alabama at Birmingham, 360 BEC, Birmingham, AL 35294.
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Abstract

Copper-refractory metal composites/alloys are of interest for aerospace and related applications requiring good thermal conductivity and high strength at elevated temperatures[1]. These materials, due to generally very low mutual solubilities, may allow high strength microstructures to be developed which are stable at temperatures exceeding those suitable for precipitation strengthened alloys. Phase stability and mechanical property characteristics of bulk fabricated Cu-refractory metal composites were recently reviewed[2-3]. This paper reports the results of structure-property studies of a series of Cu1–xTax alloys created by RF sputter deposition. It will be shown that nanoscale face-centered-cubic and body-centered-cubic Ta particles form in the Cu matrix and that these Ta particles are very resistant to coarsening at temperatures up to 900ºC. Nanoindentation studies of these alloys reveal that their strengths are also essentially unaffected by exposure to 900ºC for times up to 100 hours.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 559
Copyright
Copyright © Materials Research Society 1993

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References

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