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Thermal Conductivity and Phonon Engineering in Low-Dimensional Structures

Published online by Cambridge University Press:  10 February 2011

G. Chen ,
S. G. Volz ,
T. Borca-Tasciuc ,
T. Zeng ,
D. Song ,
K. L. Wang  and
M. S. Dresselhaus
G. Chen*
Affiliation:
Mechanical and Aerospace Engineering Department, University of California, Los Angeles, CA 90095-1597
S. G. Volz
Affiliation:
Mechanical and Aerospace Engineering Department, University of California, Los Angeles, CA 90095-1597
T. Borca-Tasciuc
Affiliation:
Mechanical and Aerospace Engineering Department, University of California, Los Angeles, CA 90095-1597
T. Zeng
Affiliation:
Mechanical and Aerospace Engineering Department, University of California, Los Angeles, CA 90095-1597
D. Song
Affiliation:
Mechanical and Aerospace Engineering Department, University of California, Los Angeles, CA 90095-1597
K. L. Wang
Affiliation:
Electrical Engineering Department, University of California, Los Angeles, CA 90095
M. S. Dresselhaus
Affiliation:
Department of Electrical Engineering and Computer Science, and Department of Physics, Massachusetts Institute of Technology, Cambridge, MA02139
*
*gchen@seas.ucla.edu
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Abstract

Understanding phonon heat conduction mechanisms in low-dimensional structures is of critical importance for low-dimensional thermoelectricity. In this paper, we discuss heat conduction mechanisms in two-dimensional (2D) and one-dimensional (1D) structures. Models based on both the phonon wave picture and particle picture are developed for heat conduction in 2D superlattices. The phonon wave model, based on the acoustic wave equations, includes the effects of phonon interference and tunneling, while the particle model, based on the Boltzmann transport equation, treats the internal as well interface scattering of phonons. For 1D systems, both the Boltzmann transport equation and molecular dynamics simulation approaches are employed. Comparing the modeling results with experimental data suggest that the interface scattering of phonons plays a crucial role in the thermal conductivity of low-dimensional structures. We also discuss the minimum thermal conductivity of low-dimensional structures based on a generalized thermal conductivity integral, and suggest that the minimum thermal conductivities of low-dimensional systems may differ from those of their corresponding bulk materials. The discussion leads to alternative ways to reduce thermal conductivity based on the propagating phonon modes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 545: Symposium Z – Thermoelectric Materials 1998 - The Next Generation… , 1998 , 357
Copyright
Copyright © Materials Research Society 1999

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