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A Thermal Spike Analysis of Low Energy Ion Activated Surface Processes

Published online by Cambridge University Press:  25 February 2011

C. M. Gilmore ,
A. Haeri  and
J. A. Sprague
C. M. Gilmore
Affiliation:
School of Engineering and Applied Science, The George Washington University Washington, DC 20052
A. Haeri
Affiliation:
School of Engineering and Applied Science, The George Washington University Washington, DC 20052
J. A. Sprague
Affiliation:
Condensed Matter and Radiation Sciences Division, U.S. Naval Research Laboratory, Washington, DC 20375-5000
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Abstract

A thermal spike analysis was utilized to predict the time evolution of energy propagation through a solid resulting from energetic particle impact. An analytical solution was developed that can predict the number of surface excitations such as desorption, diffusion or chemical reaction activated by an energetic particle. The analytical solution is limited to substrates at zero Kelvin and to materials with constant thermal diffusivities. These limitations were removed by developing a computer numerical integration of the propagation of the thermal spike through the solid and the subsequent activation of surface processes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 128: Symposium A – Processing and Characterization of Materials Using Ion Beams , 1988 , 163
Copyright
Copyright © Materials Research Society 1989

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References

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