Hostname: page-component-78c5997874-4rdpn Total loading time: 0 Render date: 2024-11-18T06:00:44.832Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermo-Mechanical Reliability of 3D-integrated Microstructures in Stacked Silicon

Published online by Cambridge University Press:  26 February 2011

Bernhard Wunderle ,
R. Mrossko ,
O. Wittler ,
E. Kaulfersch ,
P. Ramm ,
B. Michel  and
H. Reichl
Bernhard Wunderle
Affiliation:
bernd.michel@izm.fhg.de, Fraunhofer IZM, Dept. Micro Materials Center, Gustav-Meyer-Allee 25, Berlin, D-13355, Germany
R. Mrossko
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, AMIC, Berlin, N/A, Germany
O. Wittler
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, Fraunhofer IZM, Dept. Micro Materials Center, Gustav-Meyer-Allee 25, Berlin, D-13355, Germany
E. Kaulfersch
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, AMIC, Berlin, N/A, Germany
P. Ramm
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, Fraunhofer IZM, Dept. Micro Materials Center, Gustav-Meyer-Allee 25, Berlin, D-13355, Germany
B. Michel
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, Fraunhofer IZM, Dept. Micro Materials Center, Gustav-Meyer-Allee 25, Berlin, D-13355, Germany
H. Reichl
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, Technical University Berlin, Berlin, N/A, Germany
Get access

Abstract

This paper investigates the thermo-mechanical reliability of inter-chip-vias (ICV) for 3D chip stacking after processing and under external thermal loads relevant for the envisaged field of application (mobile, automotive) by Finite Element simulation. First the materials are characterised by nano-indentation to determine elasto-plastic data. Finite Element simulations are used to reproduce these data and to extract local material properties like E-modulus and yield stress. Accumulated plastic strain is used as failure indicator under periodic thermal loading of an ICV. Geometrical, material and process-related parameters are varied to obtain first design guidelines for this new technology. The locations of stress and strain accumulation are given.

Keywords

microstructureSisimulation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 970: Symposium Y – Enabling Technologies for 3-D Integration , 2006 , 0970-Y02-04
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Ramm, P., Klumpp, A., Merkel, R., Weber, J., Wieland, R., Ostmann, A., Wolf, J.. 3D System Integration Technologies. Proc. Materials Research Society Spring Meeting, San Francisco (2003), edited by McKerrow, A. J.M., Leu, J., Kraft, O., Kikkawa, T. (Mater. Res. Soc. Proc. 766, Warrendale), p. 3.Google Scholar
2. Ramm, P., “3D Integration", MRS Fall Meeting 2006, Tutorial Notes V/W/Y “Topics in Advanced Electronic Packaging” (2006)Google Scholar
3. Ramm, P., Klumpp, A., Merkel, R., Weber, J., Wieland, R.. Vertical System Integration by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding, Japanese Journal of Applied Physics 43, No. 7A (2004), p. L829.Google Scholar
4. Wunderle, B. and Michel, B.. Progress in Reliability Research in the Micro and Nano Region. Journal of Microelectronics Reliability, 46/9–11, Elsevier, 2006, pp. 1685–1694 Google Scholar
5. Schubert†, A., Dudek, R., Auerswald, E., Gollhardt, A., Michel, B. and Reichl, H.: Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation. 53rd Electronic Components and Technology Conference, New Orleans, USA, May 27–30: 603–610, 2003.Google Scholar
6. Oliver, W.C. and Pharr, G.M., An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, J. Mater. Res. 7, no. 6, 1992, pp. 1564–1583.Google Scholar
7. Pharr, G.M., Oliver, W.C and Brozen, F.R., J. Mater. Res. 7, pp. 613, 1992 Google Scholar
8. Cheng, Y.-T., Cheng, C.-M.. Can stress–strain relationships be obtained from indentation curves using conical and pyramidal indenters?, J. Mater. Res. 14,1999, p. 3493–3496 Google Scholar
9. Alkorta, J., Martínez-Esnaola, J.M., and Sevillano, J. Gil. Absence of one-to-one correspondence between elastoplastic properties and sharp-indentation load–penetration data. J. Mater. Res. 20, 2005 Google Scholar
10. Goodfellow Catalogue 2005.Google Scholar
11. Wunderle, B., Auersperg, J., Grosser, V., Kaulfersch, E., Wittler, O., and Michel, B.. Modular Parametric Finite Element Modelling for Reliability-Studies in Electronic and Mems Packaging. Proc. of Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, May 5–7, Cannes, France, pages 335–340, 2003.Google Scholar
12. Dudek, R., Walter, H., Zapf, J. and Michel, B., Investigations on Low Cycle Fatigue of Electrodeposited Thin Copper and Nickel Films, Proc. Eurosime, Aix-en-Provence, 2003.Google Scholar
13. Manson, S.S.. Thermal Stress and Low Cycle Fatigue. McGraw-Hill, NY, USA, 1966 Google Scholar
14. Vogel, D., Sabate, N., Wunderle, B., Keller, J., Michel, B. and Reichl, H.. Nanoreliability for Mechanically Loaded Devices. International Congress of Nanotechnology 2005, San Francisco, USA, Nov 1–4, 2005, 2005.Google Scholar