Published online by Cambridge University Press: 02 August 2011
Bonding of polished, polycrystalline diamond films to silicon was performed in ultra high vacuum at 32 MPa of applied uniaxial stress. The transmission electron microscopy (TEM) investigation revealed that the interface of all bonded samples was non-uniform. An abrupt boundary between the two wafers existed only in some parts of the interface, while other parts contained an amorphous interlayer of up to 40 nm in thickness. Electron energy loss spectroscopy (EELS) revealed that this interlayer consisted of oxygen, carbon and silicon. Based on comparison of the microstructure and chemical composition of the interface formed at different bonding temperatures, we propose a model for the silicon/diamond wafer fusion process.