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Unexpected Penetration of AuGe/Pt Metal into a Interface Between a Atmospheric Chemical Vapor Deposition Silicon Dioxide Film and GaAs Wafer Surface

Published online by Cambridge University Press:  22 February 2011

Yasuyuki Saito*
Affiliation:
Microelectronics Ctr. Tamagawa Works, Toshiba Corp., 1, Komukai Toshiba-cho, Saiwai-ku, Kawasaki 210, Japan
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Abstract

It was observed that thin metal (catalytic metal: platinum) penetrated into a interface between a chemical vapor deposition (CVD) silicon dioxide film and a Si–implanted electric thermal furnace, on the way to carrying out experiments on alloyed ohmic–metals with Si–implanted electrically conductive n–type GaAs crystal layers in order to obtain stable and uniform ohmic contact electrodes of low specific ohmic contact resistances for metal–semiconductor field–effect–transistor arrays as a observation tool of semi–insulating GaAs–crystal crystallographic uniformity.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

[1] Saito, Yasuyuki, ibid.Google Scholar
[2] Marlow, G.S. and Das, M.B., Solid State Electronics 25, 91(1982).Google Scholar
[3] Saito, Yasuyuki, unpublished (1983).Google Scholar
[4] Saito, Y., submitted abstract to The 40th Spring Meeting, 1993 of the Japan Society of Applied Physics and Related SocietiesGoogle Scholar
[5] Chikazumi, S., Kigoshi, K., and Tanuma, S., Revised Modem Knowledge on Elements (Japanese, Rev.ver. 1985, Tokyo-Shoseki, Tokyo).Google Scholar