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X-ray Microbeam Diffraction Measurements in Polycrystalline Aluminum and Copper Thin Films

Published online by Cambridge University Press:  01 February 2011

L. E. Moyer ,
G. S. Cargill III ,
W. Yang ,
B. C. Larson  and
G. E. Ice
L. E. Moyer
Affiliation:
Dept. Mat. Sci. and Engr., Lehigh University, Bethlehem, PA 18015, USA
G. S. Cargill III
Affiliation:
Dept. Mat. Sci. and Engr., Lehigh University, Bethlehem, PA 18015, USA
W. Yang
Affiliation:
Solid State Div., Oak Ridge National Lab., Oak Ridge, TN 37831, USA
B. C. Larson
Affiliation:
Solid State Div., Oak Ridge National Lab., Oak Ridge, TN 37831, USA
G. E. Ice
Affiliation:
Solid State Div., Oak Ridge National Lab., Oak Ridge, TN 37831, USA
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Abstract

Thermally induced residual strains in polycrystalline Cu and Al films on single crystal Si and glass substrates, respectively, have been examined on a grain-by-grain basis by x-ray microbeam diffraction. The crystallographic orientation and the deviatoric strain tensor, εij*, are determined for each grain by white beam Laue diffraction. From grain orientation mapping and strain tensor measurements, information is obtained about the distributions of strains for similarly oriented grains, about strain variations within single grains, and about grain-to-grain correlations of strains. This type of information may be useful in developing and testing theories for intergrain effects in strain evolution in polycrystals.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 795: Symposium U – Thin Films - Stresses and Mechanical Properties X , 2003 , U1.7
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1. Cargill, G.S. III, Moyer, L., Yang, W., Larson, B.C. and Ice, G.E., Mater. Sci. Forum 426–432, 3945 (2003).Google Scholar
2. Chung, J.S. and Ice, G.E., J. Appl. Phys. 86, 5249 (1999).Google Scholar
3. Chung, J.S., Tamura, N., Ice, G.E., Larson, B.C. and Budai, J.D., Mater. Res. Soc. Proc. 563, 169 (1999).Google Scholar
4. Spolenak, R., Brown, W.L., Tamura, N., MacDowell, A.A., Celestre, R.S., Padmore, H.A., Valek, B., Bravman, J.C., Marieb, T., Fujimoto, H., Batterman, B.W., and Patel, J.R., Phys. Rev. Lett. 90, 096102 (2003).Google Scholar
5. Tamura, N., MacDowell, A.A., Celestre, R.S., Padmore, H.A., Valek, B., Bravman, J.C., Spolenak, R., Brown, W.L., Marieb, T., Fujimoto, H., Batterman, B.W., and Patel, J.R., Appl. Phys. Lett. 80, 3724 (2002).Google Scholar
6. Vinci, R.P., Zielinski, E.M. and Bravman, J.C., Thin Solid Films 262, 142 (1995).Google Scholar
7. Thouless, M.D., Gupta, J. and Harper, J.M.E., J. Mater. Res. 8, 1845 (1993).Google Scholar
8. Frost, H.J. and Ashby, M.F., Deformation-Mechanism Maps: The Plasticity and Creep of Metals and Ceramics (Pergamon Press, 1982).Google Scholar