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Anisotropy in Thermal, Electrical and Mechanical Properties of Spin-Coated Polymer Dielectrics

Published online by Cambridge University Press:  22 February 2011

Sue Ann Bidstrup ,
Thomas C. Hodge ,
Linda Lin ,
Paul A. Kohl ,
J.B. Lee  and
Mark G. Allen
Sue Ann Bidstrup
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0100
Thomas C. Hodge
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0100
Linda Lin
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0100
Paul A. Kohl
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0100
J.B. Lee
Affiliation:
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0250
Mark G. Allen
Affiliation:
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0250
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Abstract

In MCM-D applications, interlayer dielectrics separate and insulate metal conductors to form a three-dimensional interconnection structure. Due to the three-dimensional nature of these structures, the thermal, electrical and mechanical properties of the dielectricmaterials must be known for all orientations in order to correctly design and simulate devices. The most commonly used polymer in microelectronics, polyimide, exists in formulations which have been shown to have a high degree of orientation and exhibit anisotropicproperties.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 338: Symposium – Materials Reliability in Microelectronics IV , 1994 , 577
Copyright
Copyright © Materials Research Society 1994

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References

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