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Benefits and Trade-offs in Multi-Level Air Gap Integration

Published online by Cambridge University Press:  01 February 2011

Romano Hoofman ,
Roel Daamen ,
Viet Nguyenhoang ,
Julien Michelon ,
Laurent G. Gosset ,
Vincent Arnal ,
Jean de Pontcharra ,
Frederic Gaillard ,
Rudy Caluwaerts  and
Christophe Bruynseraede
...Show all authors
Romano Hoofman
Affiliation:
romano.hoofman@philips.com, Philips Research, CMOS Module Integration, Kapeldreef 75, Leuven, N/A, B3001, Belgium
Roel Daamen
Affiliation:
roel.daamen@philips.com, Philips Research, Kapeldreef 75, Leuven, N/A, B3001, Belgium
Viet Nguyenhoang
Affiliation:
viet.nguyenhoang@philips.com, Philips Research, Kapeldreef 75, Leuven, N/A, B3001, Belgium
Julien Michelon
Affiliation:
julien.michelon@philips.com, Philips Research, Kapeldreef 75, Leuven, N/A, B3001, Belgium
Laurent G. Gosset
Affiliation:
laurent.gosset@philipscrolles.st.com, Philips Semiconductor, Crolles R&D, Crolles, N/A, N/A, France
Vincent Arnal
Affiliation:
vincent.arnal@st.com, ST Microelectronics, Crolles R&D, Crolles, N/A, N/A, France
Jean de Pontcharra
Affiliation:
PassemardGe@chartreuse.cea.fr, CEA-LETI, Grenoble, N/A, N/A, France
Frederic Gaillard
Affiliation:
frederic-x.gaillard@cea.fr, CEA-LETI, Grenoble, N/A, N/A, France
Rudy Caluwaerts
Affiliation:
rudy.caluwaerts@imec.be, IMEC, Leuven, N/A, N/A, Belgium
Christophe Bruynseraede
Affiliation:
christophe.bruynseraede@imec.be, IMEC, Leuven, N/A, N/A, Belgium
Gerald Beyer
Affiliation:
beyer@imec.be, IMEC, Leuven, N/A, N/A, Belgium
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Abstract

In this paper, two different air gap integration approaches are discussed in detail. Firstly, air gaps can be created using sacrificial materials, which are selectively removed through a capping layer either by wet- or dry-etching or by thermal decomposition. The second class benefits from the non-conformal deposition of different CVD dielectrics, which creates air gaps for narrow spaced lines. The benefit of air gaps in terms of capacitance reduction in multilevel interconnects is well known, therefore the authors will mainly concentrate on the challenges associated with the introduction of air gaps in interconnect systems. It will be shown that interconnect containing air gaps does not suffer more from reliability challenges than interconnects with porous low-k dielectrics. Therefore, air gaps can be considered as a viable option for the 32nm node and beyond.

Keywords

dielectric propertieselectromigrationmicroelectronics
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 914: Symposium F – Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects , 2006 , 0914-F10-01
Copyright
Copyright © Materials Research Society 2006

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References

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