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Development of Wide Bandgap Semiconductor Photonic Device Structures by Excimer Laser Micromachining

Published online by Cambridge University Press:  03 September 2012

Qiang Zhao
Affiliation:
Department of Electrical & Computer EngineeringWayne State University, Detroit, Michigan
Michael Lukitsch
Affiliation:
Department of Electrical & Computer EngineeringWayne State University, Detroit, Michigan
Jie Xu
Affiliation:
Department of Electrical & Computer EngineeringWayne State University, Detroit, Michigan
Gregory Auner
Affiliation:
Department of Electrical & Computer EngineeringWayne State University, Detroit, Michigan
Ratna Niak
Affiliation:
Department of Physics, Wayne State University, Detroit, Michigan
Pao-Kuang Kuo
Affiliation:
Department of Physics, Wayne State University, Detroit, Michigan
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Abstract

Excimer laser ablation rates of Si (111) and AlN films grown on Si (111) and r-plane sapphire substrates were determined. Linear dependence of ablation rate of Si (111) substrate, sapphire and AlN thin films were observed. Excimer laser micromachining of the AlN thin films on silicon (111) and SiC substrates were micromachined to fabricate a waveguide structure and a pixilated structure. This technique resulted in clean precise machining of AlN with high aspect ratios and straight walls.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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