Hostname: page-component-cd9895bd7-fscjk Total loading time: 0 Render date: 2024-12-22T12:15:01.538Z Has data issue: false hasContentIssue false

Effect of strain on Ni-(GeSn)x contact formation to GeSn nanowires

Published online by Cambridge University Press:  10 June 2014

M. Noroozi
Affiliation:
Department of Materials and Nano Physics, KTH Royal Institute of Technology, Isafjordsgatan 22-26, 16640 Kista, Sweden
M. Moeen
Affiliation:
Department of Devices and Circuits, KTH Royal Institute of Technology, Isafjordsgatan 22-26, 16640 Kista, Sweden Nocilis Materials, Isafjordsgatan 39, 16440 Kista, Sweden
A. Abedin
Affiliation:
Department of Devices and Circuits, KTH Royal Institute of Technology, Isafjordsgatan 22-26, 16640 Kista, Sweden
M. S. Toprak
Affiliation:
Department of Materials and Nano Physics, KTH Royal Institute of Technology, Isafjordsgatan 22-26, 16640 Kista, Sweden
H. H. Radamson
Affiliation:
Department of Devices and Circuits, KTH Royal Institute of Technology, Isafjordsgatan 22-26, 16640 Kista, Sweden
Get access

Abstract

In this study, the formation of Ni-(GeSn)x on strained and relaxed Ge1−xSnx (0.01≤x≤ 0.03) nanowires in contact areas has been investigated. The epi-layers were grown at different temperatures (290 to 380°C) by RPCVD technique. The strain in GeSn layers tailored through carefully chosen of growth parameters and virtual substrate. The nanowires were fabricated through both I-line and dry-etching. 15 nm Ni was deposited either on the contact areas or whole length of nanowires. The wires went through rapid thermal annealing at intervals of 360 to 550°C for 30s in N2 ambient. The results show the thermal stability and amount of particular phases were strain-dependent. The formation of Ni-GeSn was eased when GeSn layers were strain-free. When the Sn content is high the epi-layers suffer from Sn segregation. The Sn-rich surface impedes remarkably the Ni diffusion. The electrical conductivity measurement of nanowires shows low resistivity and Ohmic contact are obtained for Ni-GeSn.

Keywords

Type
Articles
Copyright
Copyright © Materials Research Society 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Gupta, S., Chen, R., Magyari-Kope, B., Lin, H., Yang, B., Nainani, A., Nishi, Y., Harris, J. S., and Saraswat, K. C., in Proc. IEDM, 11, 398(2011)Google Scholar
Moontragoon, P., Ikoni´c, Z. and Harrison, P., J. Semicond. Sci. Technol. 22, 742(2007)CrossRefGoogle Scholar
Vincent, B., Gencarelli, F., Bender, H., Merckling, C. and Douhard, B.. Appl. Phys. Lett. 99, 152103–1(2011)CrossRefGoogle Scholar
Radamson, H. H., Noroozi, M., Jamshidi, A., Thompson, P. E., and Östling, M., Eelectrochem. Soc. trans. 50, 527(2012)Google Scholar
Noroozi, M., Master. Thesis, KTH University, 2012.Google Scholar
Takeuchi, S., Shimura, Y., Nishimura, T., Vincent, B., Eneman, G., Clarysse, T., Demeulemeester, J. , Vantomme, A., Dekoster, J., Caymax, M., Loo, R., Sakai, A., Nakatsuka, O., Zaima, S., J. Solid-state electron. 60, 53(2011)CrossRefGoogle Scholar
Kittl, J.A., Opsomer, K., Torregiani, C., Demeurisse, C., Mertens, S., Brunco, D.P., Van Dal, M.J.H., Lauwers, A., J. Mater. Sci. and Eng. B154, 144 (2008)CrossRefGoogle Scholar
Hansson, G. V., Radamsson, H. H., Ni, W.-X., Journal of Materials Science: Materials in Electronics, 6, 292 (1995).Google Scholar
Jamshidi, A., Noroozi, M., Moeen, M., Hamawandi, B., Hallén, A., Lu, J. and Radamson, H.H., J. Surf. Coat. Technol. 230, 106(2013)CrossRefGoogle Scholar
Nur, O., Willander, M., Radamson, H. H., Sardela, M.R., Hansson, G. V., Petersson, C. S., Maex, K., Appl. Phys. Lett. 64, 440 (1994).CrossRefGoogle Scholar
Zhang, Q., Wu, N., Osipowicz, T., Bera, L. and Zhu, C., Appl. Phys. Lett. 544, 440(2005)Google Scholar