Hostname: page-component-78c5997874-m6dg7 Total loading time: 0 Render date: 2024-11-18T17:16:51.240Z Has data issue: false hasContentIssue false
  • English
  • Français

Effects of Local Interfacial Debonding on the Stress Evolution in Aluminum Interconnects

Published online by Cambridge University Press:  10 February 2011

Y. -L. Shen
Y. -L. Shen*
Affiliation:
Department of Mechanical Engineering, The University of New Mexico, Albuquerque, NM, 87131, shenyl@slider.unm.edu
Get access

Abstract

The evolution of thermal stresses in aluminum interconnects, with the presence of local debonded areas between the aluminum line and the surrounding dielectric, is studied numerically. Local interfacial debonding is presumably due to contamination during the line patterning process. Various geometrical features of the interconnect and the debond segment are assumed, and the resulting stress fields are examined by recourse to two- and three-dimensional finite element analyses. Implications of the findings to the interconnect reliability, particularly stress-induced voiding in aluminum lines, are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 473: Symposium J – Materials Reliability in Microelectronics VII , 1997 , 69
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Flinn, P. A., Mack, A. S., Besser, P. R. and Marieb, T. N., MRS Bulletin 18(12), p.26 (1993).Google Scholar
2. Flinn, P. A., MRS Bulletin 20(11), p.70 (1995).Google Scholar
3. Shen, Y.-L., “Modeling of thermal stresses in metal interconnects: effects orline aspect ratio”, submitted.Google Scholar
4. Shen, Y.-L., Suresh, S. and Blech, I. A., J. Appl. Phys. 80, p. 1388 (1996).Google Scholar
5. Gouldstone, A., Shen, Y.-L., Suresh, S. and Thompson, C. V., “Evolution of stresses in passivated and unpassivated metal interconnects”, submitted.Google Scholar
6. ABAQUS, Version 5.4, general purpose finite element program, Hibbit, Karlson and Sorensen, Inc., Pawtucket, Rhode Island (1995).Google Scholar
7. Sullivan, T. D., Annu. Rev. Mater. Sci. 26, p.333 (1996).Google Scholar