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High-Density, High-Speed Connectors Based on Flexible Etched Circuits

Published online by Cambridge University Press:  15 February 2011

David B. Wrisley Jr.
David B. Wrisley Jr.*
Affiliation:
AMP Incorporated, PO Box 3608, M.S. 21-01, Harrisburg, PA 17105-3608
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Abstract

With advances in semiconductor technology straining the ability of packaging to keep pace, conventional electrical connectors cannot always meet emerging requirements in interconnection density and signal transmission speeds.

Connectors using flexible etched circuits (FEC) can provide interconnection densities of up to 200 lines per inch and high transmission quality for signals with 250-picosecond risetimes. A practical connector design meeting these density and speed goals depends on careful consideration of connector and system tolerances, ease of application, manufacturability, and material properties.

This paper discusses a practical approach to an FEC-based connector and the influence of material properties on connector performance.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 9
Copyright
Copyright © Materials Research Society 1994

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References

[1] High Density Connectors, Technologies and Markets, BPA (Technology & Management) Ltd, Report No. 431, November, 1991.Google Scholar
[2] Hill, Jane M., Isolated Contact Physics on an Area-Array Flex Circuit Connector, Masters Thesis, Cornell University, August, 1993.Google Scholar