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High-Performance SiGe MODFET Technology

Published online by Cambridge University Press:  17 March 2011

S. J. Koester
Affiliation:
IBM Research Division, T. J. Watson Research Center 1101 Kitchawan Rd / Rte 134 P.O. Box 218 Yorktown Heights, NY 10598
J. O. Chu
Affiliation:
IBM Research Division, T. J. Watson Research Center 1101 Kitchawan Rd / Rte 134 P.O. Box 218 Yorktown Heights, NY 10598
K. L. Saenger
Affiliation:
IBM Research Division, T. J. Watson Research Center 1101 Kitchawan Rd / Rte 134 P.O. Box 218 Yorktown Heights, NY 10598
Q. C. Ouyang
Affiliation:
IBM Research Division, T. J. Watson Research Center 1101 Kitchawan Rd / Rte 134 P.O. Box 218 Yorktown Heights, NY 10598
J.A. Ott
Affiliation:
IBM Research Division, T. J. Watson Research Center 1101 Kitchawan Rd / Rte 134 P.O. Box 218 Yorktown Heights, NY 10598
D. F. Canaperi
Affiliation:
IBM Research Division, T. J. Watson Research Center 1101 Kitchawan Rd / Rte 134 P.O. Box 218 Yorktown Heights, NY 10598
J. A. Tornello
Affiliation:
IBM Research Division, T. J. Watson Research Center 1101 Kitchawan Rd / Rte 134 P.O. Box 218 Yorktown Heights, NY 10598
C.V. Jahnes
Affiliation:
IBM Research Division, T. J. Watson Research Center 1101 Kitchawan Rd / Rte 134 P.O. Box 218 Yorktown Heights, NY 10598
S. E. Steen
Affiliation:
IBM Research Division, T. J. Watson Research Center 1101 Kitchawan Rd / Rte 134 P.O. Box 218 Yorktown Heights, NY 10598
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Abstract

An overview of SiGe modulation-doped field-effect transistor (MODFET) technology is provided. The layer structures and mobility enhancements for both p- and n-channel modulation-doped quantum wells are described and compared to mobilities in Si/SiO2 inversion layers. Next, previous results on high-performance n- and p-MODFETs fabricated at IBM and elsewhere are reviewed, followed by recent results on laterally-scaled Si/SiGe n-MODFETs with gate lengths as small as 70 nm. We conclude with a discussion of the materials issues for the future vertical and lateral scaling of SiGe MODFETs.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1. Joseph, A. J., et al. , IEEE J. Solid State Circ. 38, 1471 (2003).Google Scholar
2. Mooney, P. M., Jordan-Sweet, J. L., Ismail, K., Chu, J. O., Feenstra, R. M., and LeGoues, F. K., Appl. Phys. Lett. 67, 2373 (1995).Google Scholar
3. Basu, P. K., and Paul, S. K., J. Appl. Phys. 71, 3617 (1992).Google Scholar
4. Rieger, M. M., and Vogl, P., Phys. Rev. B 48, 14276 (1993).Google Scholar
5. Fischetti, M. V., and Laux, S. E., J. Appl. Phys. 80, 2234 (1996).Google Scholar
6. Dingle, R., Störmer, H. L., Gossard, A. C., and Wiegmann, W., Appl. Phys. Lett. 37, 665 (1978).Google Scholar
7. Arafa, M., Ismail, K., Chu, J. O., Meyerson, B. S. and Adesida, I., IEEE Elect. Dev. Lett. 17, 586 (1996).Google Scholar
8. Koester, S. J., Hammond, R., Chu, J. O., Mooney, P. M., Ott, J. A., Perraud, L., Jenkins, K. A., Webster, C. S., Lagnado, I., and Houssaye, P. R. de la, IEEE Elect. Dev. Lett. 22, 92 (2001).Google Scholar
9. Koester, S. J., Hammond, R., and Chu, J. O., IEEE Elect. Dev. Lett. 21, 110 (2000).Google Scholar
10. Höck, G., Hackbarth, T., Käb, N., Herzog, H.-J., Enciso, M., Aniel, F., Crozat, P., Adde, R., Kohn, E. and König, U., Electron. Lett. 36, 1428 (2000).Google Scholar
11. Koester, S. J., Chu, J. O., and Groves, R. A., Electron. Lett. 35, 86 (1999).Google Scholar
12. Koester, S. J., Saenger, K. L., Chu, J. O., Ouyang, Q. C., Ott, J. A., Rooks, M. J., Canaperi, D. F., Tornello, J. A., Jahnes, C. V., and Steen, S. E., Electron. Lett. 39, 1684 (2003).Google Scholar
13. Aniel, F., Zerounian, N., Adde, R., Zeuner, M., Hackbarth, T., and König, U., IEEE Trans. Elect. Dev. 47, 1477 (2000).Google Scholar
14. Sugii, N., Nakagawa, K., Yamaguchi, S., Park, S. K., and Miyao, M., Thin Solid Films 369, 362 (2000).Google Scholar
15. Takagi, S., Hoyt, J. L., Welser, J. J., and Gibbons, J. F., J. Appl. Phys. 80, 1567 (1996).Google Scholar
16. Enciso-Aguilar, M., Aniel, F., Crozat, P., Adde, R., Höck, G., Hackbarth, T., and König, U., Electron. Lett. 37, 1478 (2001).Google Scholar
17. Lu, W., Wang, X. W., Hammond, R., Kuliev, A., Koester, S., Chu, J. O., Ismail, K., Ma, T. P., and Adesida, I., IEEE Elect. Dev. Lett. 20, 514 (1999).Google Scholar
18. Ismail, K., Chu, J. O., and Arafa, M., IEEE Elect. Dev. Lett. 18, 435 (1997).Google Scholar
19. Ismail, K., IEDM Tech. Digest, 509 (1995).Google Scholar
20. Koester, S. J., Chu, J. O., and Groves, R. A., Electron. Lett. 35, 86 (1999).Google Scholar
21. Glück, M., Hackbarth, M., U. König, Haas, A., Höck, G., and Kohn, E., Electron. Lett. 33, 335 (1998).Google Scholar
22. Glück, M., Hackbarth, T., Birk, M., Haas, A., Kohn, E., and König, U., Physica E 2, 763 (1998).Google Scholar
23. Enciso-Aguilar, M., Aniel, F., Crozat, P., Adde, R., Herzog, H. J., Hackbarth, I., König, U., and Kanel, H. von, Electron. Lett. 39, 149 (2003).Google Scholar
24. Doris, B. et al. , IEDM Tech. Digest, 267 (2002).Google Scholar
25. Zeuner, M., Fox, A., Hackbarth, T., Behammer, D., and König, U., 60th Annual Device Research Conference, Santa Barbara, CA, 2002.Google Scholar
26. Chu, J. O., Koester, S. J., Ott, J. A., Shi, L., Ouyang, Q. C., and Saenger, K. L., Materials Research Society Spring Meeting, San Francisco, CA, 2004.Google Scholar
27. Huang, L. J., Chu, J. O., Canaperi, D., D'Emic, C., Anderson, R., Koester, S., and Wong, H.-S. P., Appl. Phys. Lett. 78, 1267 (2001).Google Scholar
28. Koester, S. J., Chu, J. O., Bedell, S., Saenger, K. L., Ott, J. A., and Sadana, D., to be published.Google Scholar