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Micromachining of Silicon Mechanical Structures

Published online by Cambridge University Press:  25 February 2011

G. Kaminsky
G. Kaminsky*
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, NJ 08544.
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Abstract

Refined processing procedures for producing geometrically highly precise silicon structures are described. The structures are fabricated by the high-precision micromachining of silicon utilizing wet chemical orientation and/or concentration dependent, etching techniques. Very exact processing procedures required to reproducibly achieve good high quality structures with excellent large and small scale uniformity are detailed. Relief structures having features as small as 0.2μm have been produced. Some of the structures and devices attainable will be described including: (1) very high Q torsional oscillators useful as powerful probes of the mechanical properties of a variety of physical systems, (2) unstrained focusing x-ray mirrors, and (3) μm dimension mechanical “shadow masks” with multiple slit features having knife-edge acuity of much better than 1μm over an area ˜1cm2 and useful for noncontaminative, in situ patterning of thin films deposited in MBE or other vacuum deposition techniques.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 76: Symposium C – Science and Technology of Microfabrication , 1986 , 111
Copyright
Copyright © Materials Research Society 1987

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