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Polymer/Metal Interconnection Systems for Microelectronics Packaging

Published online by Cambridge University Press:  15 February 2011

Ho-Ming Tong
Ho-Ming Tong*
Affiliation:
IBM East Fishkill Facility Hopewell Junction, New York 12533
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Abstract

This article provides an overview on polymer/metal interconnection systems for microelectronics packaging. It will begin with a description of the functions of interconnection, and types of polymer/metal interconnection techniques available with tape automated bonding (TAB) being the most popular for chip connection applications. This is followed by examples of worldwide TAB applications and market outlook, TAB tape offerings and trends, as well as the entire TAB technology including tape types and fabrication, substrates interconnected by TAB, bonding techniques, TAB mounting options and TAB package encapsulation. Finally, future challenges on the most demanding fine-pitch TAB technology will be discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 51
Copyright
Copyright © Materials Research Society 1992

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