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Simulation of mold deformation and pattern interaction in nanoimprint lithography

Published online by Cambridge University Press:  08 April 2014

Nicolas Cleveland  and
Hongwei Sun
Nicolas Cleveland
Affiliation:
Francis School of Engineering, University of Massachusetts Lowell, United States
Hongwei Sun
Affiliation:
Francis School of Engineering, University of Massachusetts Lowell, United States
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Abstract

As an emerging manufacturing technique, nanoimprint lithography (NIL) can fabricate micro and nanoscale features of microfluidic devices at very high accuracy and reliability. In high-temperature TNIL process, a polymer melt such as polymethyl-methacrylate (PMMA) is heated beyond the melting temperature so that it behaves predominantly as a fluid during the imprint process. The process parameters such as pressure, temperature, and material properties play critical roles in the NIL process. In this work, the process of thermal nanoimprint lithography (TNIL) is studied computationally with emphasis on the effect of soft-mold deformation on polymer melt flow and finished result by-way-of fluid-structure interaction (FSI) technology. Process is assumed isothermal at 180 °C. Applications of this modeling technique range from micro- and nano-patterns used in micro-channels for biomedical devices to other applications such as biological/particle sensors or super-hydrophobic surfaces. The simulation result is compared to experimental results, and traits observed in TNIL done with soft mold are supported and explained through numerical results.

Keywords

simulationmicrostructurepolymer
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1626: Symposium K – Micro- and Nanoscale Processing of Materials for Biomedical Devices , 2014 , mrsf13-1626-k11-03
Copyright
Copyright © Materials Research Society 2014 

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References

REFERENCES

Chou, S. Y., Krauss, P. R., and Renstrom, P. J., 1995, “Imprint of sub-25 nm vias and trenches in polymers,” Applied Physics Letters, 67(21), p. 3114.CrossRefGoogle Scholar
Lee, Y. H., Sin, H.-C., and Kim, N. W., 2009, “Impact of slip and contact angle on imprinting pressure in nanoimprint lithography,” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 27(2), p. 590.CrossRefGoogle Scholar
Kim, S. M., Kang, J. H., and Lee, W. I., 2011, “Analysis of polymer flow in embossing stage during thermal nanoimprint lithography,” Polymer Engineering & Science, 51(2), pp. 209–217.CrossRefGoogle Scholar
Kim, N. W., Kim, K. W., and Sin, H.-C., 2008, “Finite element analysis of low temperature thermal nanoimprint lithography using a viscoelastic model,” Microelectronic Engineering, 85(9), pp. 1858–1865.CrossRefGoogle Scholar
Kang, J. H., Kim, S. M., Woo, Y. S., and Lee, W. I., 2008, “Analysis of resin flow during nano-imprinting lithographic process,” Current Applied Physics, 8(6), pp. 679–686.CrossRefGoogle Scholar
Takagi, H., Takahashi, M., Maeda, R., Onishi, Y., Iriye, Y., Iwasaki, T., and Hirai, Y., 2008, “Analysis of time dependent polymer deformation based on a viscoelastic model in thermal imprint process,” Microelectronic Engineering, 85(5-6), pp. 902–906.CrossRefGoogle Scholar
Hirai, Y., Onishi, Y., Tanabe, T., Shibata, M., Iwasaki, T., and Iriye, Y., 2008, “Pressure and resist thickness dependency of resist time evolutions profiles in nanoimprint lithography,” Microelectronic Engineering, 85(5-6), pp. 842–845.CrossRefGoogle Scholar
Hirai, Y., Konishi, T., Yoshikawa, T., and Yoshida, S., 2004, “Simulation and experimental study of polymer deformation in nanoimprint lithography,” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 22(6), p. 3288.CrossRefGoogle Scholar
Mohamed, K., Alkaisi, M. M., and Smaill, J., 2006, “Resist deformation at low temperature in nanoimprint lithography,” Current Applied Physics, 6(3), pp. 486–490.CrossRefGoogle Scholar
Rowland, H. D., Sun, A. C., Schunk, P. R., and King, W. P., 2005, “Impact of polymer film thickness and cavity size on polymer flow during embossing: toward process design rules for nanoimprint lithography,” Journal of Micromechanics and Microengineering, 15(12), pp. 2414–2425.CrossRefGoogle Scholar
Rowland, H. D., King, W. P., Sun, A. C., and Schunk, P. R., 2005, “Simulations of nonuniform embossing: The effect of asymmetric neighbor cavities on polymer flow during nanoimprint lithography,” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 23(6).CrossRefGoogle Scholar
Taylor, H. K., 2009, “Modeling and Controlling Topographical Nonuniformity in Thermoplastic Micro- and Nano-Embossing,” Doctor of Philosophy in Electrical Engineering and Computer Science Doctoral, Massachusetts Institute of Technology, Cambridge.Google Scholar
Hirt, C. W., and Nichols, B. D., 1981, “Volume of fluid (VOF) method for the dynamics of free boundaries,” Journal of Computational Physics, 39(1), pp. 201–225.CrossRefGoogle Scholar
Brackbill, J.U., , K., Zemach, C., 1992, “A Continuum Method for Modeling Surface Tension,” Journal of Computational Physics, 100, pp. 335–354.CrossRefGoogle Scholar
Cleveland, N. J., 2013, “Computational study of a high-temperature thermal nanoimprint lithographic (TNIL) process,” M.S.M.E., University of Massachusetts Lowell, Lowell.Google Scholar
Fan, B., and Kazmer, D. O., 2005, “Low-temperature modeling of the time-temperature shift factor for polycarbonate,” Advances in Polymer Technology, 24(4), pp. 278–287.CrossRefGoogle Scholar