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Structural and Piezoresistive Characteristics of Amorphous Silicon Carbide Films Grown on AlN/Si Substrates

Published online by Cambridge University Press:  13 June 2012

Mariana A. Fraga
Affiliation:
Institute for Advanced Studies, Department of Aerospace Science and Technology, 12228-001, S. J. dos Campos, Brazil Plasma and Processes Laboratory, Department of Physics, Technological Institute of Aeronautics, 12228-900, S. J. dos Campos, SP, Brazil
Humber Furlan
Affiliation:
Faculty of Technology of São Paulo, Praça Cel. Fernando Prestes, 30, São Paulo –SP, 01124-060, Brazil
Rodrigo S. Pessoa
Affiliation:
Plasma and Processes Laboratory, Department of Physics, Technological Institute of Aeronautics, 12228-900, S. J. dos Campos, SP, Brazil IP&D, University of Vale do Paraíba, 12244-000, S. J. dos Campos, SP, Brazil
Luiz A. Rasia
Affiliation:
Regional University of Northwest Rio Grande do Sul State, Ijui- RS, 98700-000, Brazil
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Abstract

Amorphous silicon carbide (a-SiC) thin films have been grown on aluminum nitride (AlN) intermediate layers on (100) Si substrates by RF magnetron sputtering technique. Profilometry, four-point probe method, Rutherford backscattering spectroscopy (RBS) and Fourier transform infrared (FTIR) were employed to characterize the as-deposited SiC thin films. Test structures have been developed to investigate the piezoresistive properties. These structures consist of SiC thin-film resistors on AlN/Si substrates defined by reactive ion etching (RIE) with Ti/Au pads formed by lift-off process. Gauge factor (GF) and temperature coefficient of resistance (TCR) measurements have been performed and demonstrated the potential of these resistors to be used as sensing elements in devices for high temperature application.

Type
Research Article
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

1. de la Puente, G. G., Erlenbach, O., Torres, J. A. G., Hupfer, T., Steidl, M., De Zela, F., Weingärtner, R., Winnacker, A., Materials Science Forum 645648 (2010) 11991202.Google Scholar
2. Elmazria, O. and Aubert, T., Proc. SPIE 8066 (2011) 8066021–10.Google Scholar
3. Doppalapudi, D., Sensors Based on SiC-AlN MEMS, www.electrochem.org/dl/ma/206/pdfs/1239.pdf.Google Scholar
4. Chung, G. and Lee, T., Materials Science Forum 600603 (2009) 12891292.Google Scholar
5. Jeong, Ju., Jang, K., Lee, H. S., Chung, G., Kim, G., Physica Condensed Matter 404 (2009) 710.Google Scholar
6. Wu, C. H., Zorman, C. A., Mehregany, M., IEEE Sensors Journal. 6 (2006) 316324.Google Scholar
7. Kuo, H., Proceedings of 12th International Conference on Transducers, Solid-State Sensors, Actuators and Microsystems (2003) 742745.Google Scholar
8. Dolittle, L. R., Nucl. Instrum. Methods Phys. Res. B 9 (1985) 344351.Google Scholar
9. Fraga, M. A., Furlan, H., Massi, M., Oliveira, I. C., Microsystem Technologies 16 (2010) 925930.Google Scholar
10. Medeiros, H. S., Pessoa, R. S., Sagás, J. C., Fraga, M. A., Santos, L. V., Maciel, H. S., Massi, M., da Silva Sobrinho, A. S., Maia da Costa, M. E. H., Surface & Coatings Technology, 206 (2011) 17871795.Google Scholar
11. Fraga, M. A., Massi, M., Oliveira, I. C., Maciel, H. S., dos Santos Filho, S. G., Mansano, R. D., J. Mater. Sci.: Mater Electron 19 (2008) 835840.Google Scholar
12. Medeiros, H. S., Pessoa, R. S., Sagás, J. C., Fraga, M. A., Santos, L. V., Maciel, H. S., Massi, M., da Silva Sobrinho, A. S., Materials Science Forum 717720 (2012) 197201.Google Scholar
13. Fraga, M. A., Materials Science Forum 679680 (2011) 217220.Google Scholar
14. Ziermann, R., von Berg, J., Obermeier, E., Wischmeyer, F., Niemann, E., Moller, H., Eickhoff, M., Krotz, G., Materials Science and Engineering B6162 (1999) 576578.Google Scholar